IEEE Israel Section

You are invited to attend a lecture on Wednesday, May 3, 2023 at 12:00 Wolfson Engineering Building, Room 206 Join Zoom Meeting https://tau-ac-il.zoom.us/j/83060796575 Invited speaker: Prof. Zhongxiang Shen, IEEE Antennas and Propagation Society Distinguished Lecturer Nanyang Technological University, Singapore Abstract In this talk, we intend to provide a brief overview of electromagnetic selective surfaces/structures (EMSS). ... Read more

09:00-09:30 Registration & Coffee 09:30-09:40 Welcome and Opening Remarks, Amir Boag, Yarden Mazor 09:40-10:40 Andrea Massa, A. Benoni, P. Da Rù, G. Oliveri, L. Poli, P. Rocca, M. Salucci, F. Zardi – University of Trento, Italy Keynote: The "Smart EM Environment" Paradigm as Enabler of Next Generation Wireless Systems - An Overview from the Device-Scale ... Read more

חבר/ת IEEE ישראל יקר/ה, אני מתכבד להזמין אותך ביום חמישי בתאריך ה- 11.5.2023 לאסיפה הכללית לשנת 2023 של הארגון, אשר תתקיים באופן היברידי, בזום או במפגש פיזי בלשכת המהנדסים, בית המהנדס, רחוב דיזינגוף 200 - לבחירתך. האסיפה תפתח להצטרפות החל משעה 16:30, ותתקיים בכל מספר נוכחים החל משעה 17:00. האסיפה הכללית היא המוסד העליון של ... Read more

Dear Colleagues, You are cordially invited to attend The 11th IEEE Israel AP/MTT Chapter and Tel Aviv University Underwater Acoustics Symposium, Thursday 15 June, 2023. A preliminary program of the ... Read more

The 10th edition of the Haifa conference on marine sciences will take place (in-person) on 20th of June 2023 with the theme of: SeaAI: Artificial Intelligence and Sea. SeaAI is ... Read more

On behalf of the IEEE COMCAS 2023 Steering Committee, it is our pleasure to launch the 9th International IEEE Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems (IEEE ... Read more

Abstract Neural network (NN) models are rapidly increasing in size and complexity, surpassing the pace of NN chip upgrades. The development of monolithic chips to match these evolving models is both expensive and challenging. Alternatively, modular chiplets can be designed and reused to create multi-chip packages (MCPs) capable of addressing diverse NN models and tasks. ... Read more

A system-on-a-chip or system-on-chip is an integrated circuit that integrates most or all components of a computer or other electronic system. During the lecture, the system on chip will be ... Read more

In recent years EDA is shifting more and more to the AWS cloud to accelerate time to tapeout, with companies like Arm, NXP and Marvell openly speaking about their cloud ... Read more

הסניף הישראלי של IEEE Electronic Packaging Society וענף זיווד אלקטרוני ומיקרואלקטרוני בלשכת המהנדסים והאדריכלים, מזמינים אתכם/ן לקחת חלק ביום עיון שיעסוק במחברים אלקטרו-מכאניים. יום חמישי |11.4.2024| 08:30-16:00| מכון מופ"ת, שושנה ... Read more