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The 11th IEEE Israel AP/MTT and Tel Aviv University Underwater Acoustics Symposium

Room: Rosenblatt Auditorium, Bldg: Software Engineering building, Tel Aviv University, Tel Aviv, Tel Aviv District, Israel

Dear Colleagues, You are cordially invited to attend The 11th IEEE Israel AP/MTT Chapter and Tel Aviv University Underwater Acoustics Symposium, Thursday 15 June, 2023. A preliminary program of the conference is attached. Participation is free of charge, but advance registration at http://web.eng.tau.ac.il/boag/conf2/ is required. The same link is embedded in the program. Please spread ... Read more

SeaAI Artificial Intelligence and Sea

University of Haifa, Haifa, Haifa District, Israel

The 10th edition of the Haifa conference on marine sciences will take place (in-person) on 20th of June 2023 with the theme of: SeaAI: Artificial Intelligence and Sea. SeaAI is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their research findings, ideas, and applications in the areas ... Read more

IEEE COMCAS 2023 – May 6, 2023 – Summary / Paper submission deadline (Updated!)

DAVID INTERCONTINENTAL HOTEL, Tel Aviv, Tel Aviv District, Israel

On behalf of the IEEE COMCAS 2023 Steering Committee, it is our pleasure to launch the 9th International IEEE Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems (IEEE COMCAS 2023). In 2023 the international IEEE COMCAS will continue to evolve and provide an advanced multidisciplinary forum for the exchange of ideas, research results, ... Read more

Chiplet approaches to scale up and scale out machine learning computation, Prof. Zhengya Zhang, University of Michigan, Ann Arbor

Virtual: https://events.vtools.ieee.org/m/387202

Abstract Neural network (NN) models are rapidly increasing in size and complexity, surpassing the pace of NN chip upgrades. The development of monolithic chips to match these evolving models is both expensive and challenging. Alternatively, modular chiplets can be designed and reused to create multi-chip packages (MCPs) capable of addressing diverse NN models and tasks. ... Read more

On-chip Engineering

Eshel, Southern District, Israel

A system-on-a-chip or system-on-chip is an integrated circuit that integrates most or all components of a computer or other electronic system. During the lecture, the system on chip will be overviewed followed by the experimental demonstrations. Co-sponsored by: Prof Alina Karabchevsky Eshel, Southern District, Israel

Accelerating Time to Tapeout – 6 reasons to utilize the cloud

Virtual: https://events.vtools.ieee.org/m/409166

In recent years EDA is shifting more and more to the AWS cloud to accelerate time to tapeout, with companies like Arm, NXP and Marvell openly speaking about their cloud adoption journey. In this session we cover the 6 reasons companies are moving EDA to AWS, as well as the the latest announcements made by ... Read more

Full day Seminar on electro-mechanical connectors

מכון מופ"ת, שושנה פרסיץ 13, תל-אביב, Tel Aviv, Tel Aviv District, Israel

הסניף הישראלי של IEEE Electronic Packaging Society וענף זיווד אלקטרוני ומיקרואלקטרוני בלשכת המהנדסים והאדריכלים, מזמינים אתכם/ן לקחת חלק ביום עיון שיעסוק במחברים אלקטרו-מכאניים. יום חמישי |11.4.2024| 08:30-16:00| מכון מופ"ת, שושנה ... Read more

IEEE Israel – 2024 General Assembly, 7.5.2024

Virtual: https://events.vtools.ieee.org/m/416156

חבר/ת IEEE ישראל יקר/ה, אני מתכבד להזמין אותך לאסיפה הכללית לשנת 2024 של הארגון, אשר תתקיים באופן מקוון באמצעות ZOOM ביום שלישי, 7.5.2024. האסיפה תפתח להצטרפות החל משעה 16:30, ותתקיים ... Read more