IEEE Israel – 2023 General Assembly, 11.5.2023
Bldg: לשכת המהנדסים, בית המהנדס, 200 Dizengoff Street, Tel Aviv, Tel Aviv District, Israel, Virtual: https://events.vtools.ieee.org/m/353636חבר/ת IEEE ישראל יקר/ה, אני מתכבד להזמין אותך ביום חמישי בתאריך ה- 11.5.2023 לאסיפה הכללית לשנת 2023 של הארגון, אשר תתקיים באופן היברידי, בזום או במפגש פיזי בלשכת המהנדסים, בית המהנדס, רחוב דיזינגוף 200 - לבחירתך. האסיפה תפתח להצטרפות החל משעה 16:30, ותתקיים בכל מספר נוכחים החל משעה 17:00. האסיפה הכללית היא המוסד העליון של ... Read more
The 11th IEEE Israel AP/MTT and Tel Aviv University Underwater Acoustics Symposium
Room: Rosenblatt Auditorium, Bldg: Software Engineering building, Tel Aviv University, Tel Aviv, Tel Aviv District, IsraelDear Colleagues, You are cordially invited to attend The 11th IEEE Israel AP/MTT Chapter and Tel Aviv University Underwater Acoustics Symposium, Thursday 15 June, 2023. A preliminary program of the conference is attached. Participation is free of charge, but advance registration at http://web.eng.tau.ac.il/boag/conf2/ is required. The same link is embedded in the program. Please spread ... Read more
SeaAI Artificial Intelligence and Sea
University of Haifa, Haifa, Haifa District, IsraelThe 10th edition of the Haifa conference on marine sciences will take place (in-person) on 20th of June 2023 with the theme of: SeaAI: Artificial Intelligence and Sea. SeaAI is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their research findings, ideas, and applications in the areas ... Read more
IEEE COMCAS 2023 – May 6, 2023 – Summary / Paper submission deadline (Updated!)
DAVID INTERCONTINENTAL HOTEL, Tel Aviv, Tel Aviv District, IsraelOn behalf of the IEEE COMCAS 2023 Steering Committee, it is our pleasure to launch the 9th International IEEE Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems (IEEE COMCAS 2023). In 2023 the international IEEE COMCAS will continue to evolve and provide an advanced multidisciplinary forum for the exchange of ideas, research results, ... Read more
Chiplet approaches to scale up and scale out machine learning computation, Prof. Zhengya Zhang, University of Michigan, Ann Arbor
Virtual: https://events.vtools.ieee.org/m/387202Abstract Neural network (NN) models are rapidly increasing in size and complexity, surpassing the pace of NN chip upgrades. The development of monolithic chips to match these evolving models is ... Read more
On-chip Engineering
Eshel, Southern District, IsraelA system-on-a-chip or system-on-chip is an integrated circuit that integrates most or all components of a computer or other electronic system. During the lecture, the system on chip will be ... Read more
Accelerating Time to Tapeout – 6 reasons to utilize the cloud
Virtual: https://events.vtools.ieee.org/m/409166In recent years EDA is shifting more and more to the AWS cloud to accelerate time to tapeout, with companies like Arm, NXP and Marvell openly speaking about their cloud ... Read more
Full day Seminar on electro-mechanical connectors
מכון מופ"ת, שושנה פרסיץ 13, תל-אביב, Tel Aviv, Tel Aviv District, Israelהסניף הישראלי של IEEE Electronic Packaging Society וענף זיווד אלקטרוני ומיקרואלקטרוני בלשכת המהנדסים והאדריכלים, מזמינים אתכם/ן לקחת חלק ביום עיון שיעסוק במחברים אלקטרו-מכאניים. יום חמישי |11.4.2024| 08:30-16:00| מכון מופ"ת, שושנה ... Read more
IEEE Israel – 2024 General Assembly, 7.5.2024
Virtual: https://events.vtools.ieee.org/m/416156חבר/ת IEEE ישראל יקר/ה, אני מתכבד להזמין אותך לאסיפה הכללית לשנת 2024 של הארגון, אשר תתקיים באופן מקוון באמצעות ZOOM ביום שלישי, 7.5.2024. האסיפה תפתח להצטרפות החל משעה 16:30, ותתקיים ... Read more
100-300 GHz Wireless: transistors, ICs, systems – Prof. Mark Rodwell, University of California, Santa Barbara
Virtual: https://events.vtools.ieee.org/m/419492Biography Mark Rodwell holds the Doluca Family Endowed Chair in Electrical and Computer Engineering at UCSB and directs the SRC/DARPA Center for Converged TeraHertz Communications and Sensing. His research group ... Read more