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"Introduction to Electronic & Microelectronic Packaging" course

Virtual: https://events.vtools.ieee.org/m/298848

A new course with a collaboration between IEEE EPS Israel and the dept. of mechanuck enguneering in Ben Gurion University. The agenda of the course includes subjects such as: system engineering, specs, enviromental conditions, adhesives, soldering, PCB, thermal management, dynamic design of electronic systems, FEA, screws and nuts, microelectronic packaging and more... Virtual: https://events.vtools.ieee.org/m/298848