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RE: Monthly webinar โ€“ Automotive: Transitioning to Centralized Architectures

Virtual: https://events.vtools.ieee.org/m/418799

RE: Monthly webinar โ€“ Automotive: Transitioning to Centralized Architectures Speaker: Mr. Moshe Anschel, Technical Fellow at General Motors Date: Sunday, May 19th, 2024 4:30 PM (Israel Time). Dear IEEE Israel chapter members, Dear guests, The IEEE Computer Society Israel conducts a series of webinars in different areas of computer systems, Software engineering, Computer architectures, data ... Read more

ื”ื›ื ืก ื”ื‘ื™ื ืœืื•ืžื™ – INCOSE IL 2024 – ื”ื ื“ืกืช ืžืขืจื›ื•ืช ื‘ืขื™ื“ืŸ ื”-AI – ืžื’ืžื•ืช ื•ื™ื™ืฉื•ืžื™ื

Bldg: Daniel Herzliya Hotel, 60 Ramat Yam St, Herzliya, Central District, Israel, 46851

ื”ืื™ื’ื•ื“ ื”ื™ืฉืจืืœื™ ืœื”ื ื“ืกืช ืžืขืจื›ื•ืช (INCOSE-IL) ืžื–ืžื™ืŸ ื ืฆื™ื’ื™ื ื•ืขืžื™ืชื™ื ืžืืจื’ื•ื ื™ื›ื ืœื”ืฉืชืชืฃ ื‘ื›ื ืก ื”ืฉื ืชื™ - ื”ื ื“ืกืช ืžืขืจื›ื•ืช ื‘ืขื™ื“ืŸ ื”-AI ืฉื™ื™ืขืจืš ื‘- 3.6.2024 ื‘ืžืœื•ืŸ ื“ื ื™ืืœ ื‘ื”ืจืฆืœื™ื”. ื‘ื™ื•ื ืฉืœื™ืฉื™ ื”-4.6.2024 ื ืงื™ื™ื ื™ื•ื ืฉืœ ืกื“ื ืื•ืช ื‘ืื•ืคืŸ ืžืงื•ื•ืŸ ื‘ื”ืฉืชืชืคื•ืช ืžืจืฆื™ื ืžื”ืืจืฅ ื•ืžื—ื•"ืœ. ื”ื›ื ืก ื”ืฉื ื” ื”ื™ื ื• ื”ื–ื“ืžื ื•ืช ืœืฉืชืฃ ืื•ื›ืœื•ืกื™ื•ืช ืจื—ื‘ื•ืช ืžื”ืชืขืฉื™ื™ื” ื•ื”ืืงื“ืžื™ื” ื‘ื ื•ืฉืื™ ื”ื ื“ืกืช ืžืขืจื›ื•ืช ื•ืœื™ืฆื•ืจ ื‘ืขืงื‘ื•ืชื™ื• ื”ื™ื›ืจื•ื™ื•ืช ื‘ื™ืŸ ื”ืขื•ืกืงื™ื ื‘ื”ื ื“ืกืช ืžืขืจื›ื•ืช, ... Read more

The 4th Annual & Students Conference of the Israeli Smart Transportation Research Center

Bldg: 70, Ben gurion University, BEER-SHEVA, Southern District, Israel, 84105

Resilience to Disruption and Disaster The 4th Annual & Students Conference of the Israeli Smart Transportation Research Center Co-sponsored by: ISTRC, BGU Agenda: Program Overview The conference will be held at Senate Hall, Building 71 09:15-09:45 Registration 10:45-11:15 Greetings and Intro - Prof. Raz Jelinek, VP and Dean for Research and Development - Tchiya Allon, ... Read more

Webinar – Universal Chiplet Interconnect ExpressTM (UCIeTM): An Open Interconnect Standard for Innovations On-Package

Virtual: https://events.vtools.ieee.org/m/430368

RE: Monthly webinar โ€“ Universal Chiplet Interconnect ExpressTM (UCIeTM): An Open Interconnect Standard for Innovations On-Package Speaker: Dr. Debendra Das Sharma, Senior Fellow, co-GM Memory and I/O Technologies, Intel Date: Monday, August 26th, 2024 5:00 PM (Israel Time). Dear IEEE Israel chapter members, Dear guests, The IEEE Computer Society Israel conducts a series of webinars ... Read more

VCSEL Consortium Annual Meeting

Bldg: Institute for National Security Studies (INSS), Chaim Levanon St 40, Tel Aviv-Yafo, Tel Aviv, Tel Aviv District, Israel

You are cordially invited to the annual meeting highlighting the VCSEL Consortium achievements by the Consortium members including two lectures by prominent guest scientists in the field. Co-sponsored by: Israel Innovation Authority Agenda: 08:30-09:00 Get together 09:00-09:30 Introduction: Dr. Yehoshua Kalisky, Technical Manager Dr. Yoram Karny, Chairman of the Cosortium Greetings: Dr. Ilan Steiner, Chief ... Read more

New Trends and Developments in the World of Photonics

Bldg: Yavne Cultural Center, Olesh 1, Yavne, Tel Aviv District, Israel

SOREQ/ISORAD and Photonics Israel invite engineers and scientists from the photonics industry and academia to attend the conference and participate in a tour of the Israel Center for Advanced Photonics' Lab. Co-sponsored by: Israel Center for Advanced Photonics (ACAP) Speaker(s): Lutz Aschke, Alon Stopel, Ohad Zohar Agenda: [] Bldg: Yavne Cultural Center, Olesh 1, Yavne, ... Read more

ื”ืคื—ืชืช ืจืขืฉื™ื ื‘ื›ืจื˜ื™ืกื™ื ืืœืงื˜ืจื•ื ื™ื

Virtual: https://events.vtools.ieee.org/m/438854

IEEE EMC & SI, PI Israel ื•ืื™ื’ื•ื“ ืžื”ื ื“ืกื™ ื”ืืœืงื˜ืจื•ื ื™ืงื” ื‘ืœืฉื›ืช ื”ืžื”ื ื“ืกื™ื ืžื–ืžื™ื ื™ื ืœื•ื•ื‘ื™ื ืจ ืœืœื ืขืœื•ืช ื‘ื ื•ืฉื: ื”ืคื—ืชืช ืจืขืฉื™ื ื‘ื›ืจื˜ื™ืกื™ื ืืœืงื˜ืจื•ื ื™ื: ื›ืœื™ื ื•ื’ื™ืฉื•ืช ืžืชืงื“ืžื•ืช ืœ Board Design ืคืœื™ื˜ื” ืืœืงื˜ืจื•-ืžื’ื ื˜ื™ืช ืžื›ืจื˜ื™ืก ืืœืงื˜ืจื•ื ื™, ื ื‘ื“ืงืช ืขืคโ€ื™ ืชืงื ื™ื ืื–ืจื—ื™ื™ื /ืฆื‘ืื™ื™ื, ื•ืžื”ื•ื•ื” ืืชื’ืจ, ืœืžืชื›ื ืŸ ื”ืžืขื’ืœื™ื ื‘ืžื™ื•ื—ื“ ื›ื›ืœ ืฉืงืฆื‘ื™ ื”ืชืงืฉื•ืจืช ืขื•ืœื™ื, ื”ื™ืขื™ืœื•ืช ื”ืื ืจื’ื˜ื™ืช ืขื•ืœื”, ื•ืื™ืœื•ืฆื™ ืžืงื•ื ื•ืชื›ืŸ ืงืฉื•ื—ื™ื ื™ื•ืชืจ. ืืชื’ืจ ื’ื“ื•ืœ ื™ื•ืชืจ ... Read more

Efficient Hardware Implementation of Deep Learning Computation and its Application – Prof. Seokbum Ko, University of Saskatchewan, Canada

Virtual: https://events.vtools.ieee.org/m/446950

Abstract: Deep learning can provide superior performance in many fields of applications. However, the cost of implementing deep learning models in practical applications is expensive. Deep learning models are both computation intensive and memory intensive. Computation is an important aspect for deep learning. It can determine the latency that is how fast the results can ... Read more

IEEE Photonics Society Distinguished Lecturer, Daniel Renner: Monolithic, Heterogeneous and Hybrid Photonic Integration

Room: 329 (third floor), Bldg: Engineering Building, Bar Ilan University, Ramat Gan, Tel Aviv District, Israel

Photonic integration has been at the center of photonic activity for several years. Over this period, great strides have been made to increase the integration density and integrated chip functionality. This talk will work its way up from the drivers for photonic integration โ€“ why do we need Photonic Integrated Circuits (PICs)? What are their ... Read more

Batteries not Included: Circuits and Systems that Sense and Self-Power – Prof. Matthew Johnston, Oregon State University

Virtual: https://events.vtools.ieee.org/m/448413

Abstract: Future wearable devices and other deployed sensor systems, including smart agriculture or environmental monitoring, will require new approaches for long-term powering and operation that avoid individual battery recharging. One approach is the use of thermoelectric energy harvesting, where energy is extracted from thermal gradients using a solid-state thermoelectric generator (TEG). Even centimeter-scale TEGs can ... Read more