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Webinar – Universal Chiplet Interconnect ExpressTM (UCIeTM): An Open Interconnect Standard for Innovations On-Package
Virtual: https://events.vtools.ieee.org/m/430368RE: Monthly webinar – Universal Chiplet Interconnect ExpressTM (UCIeTM): An Open Interconnect Standard for Innovations On-Package Speaker: Dr. Debendra Das Sharma, Senior Fellow, co-GM Memory and I/O Technologies, Intel Date: Monday, August 26th, 2024 5:00 PM (Israel Time). Dear IEEE Israel chapter members, Dear guests, The IEEE Computer Society Israel conducts a series of webinars ... Read more