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DTSTART;TZID=Asia/Jerusalem:20240826T170000
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SUMMARY:Webinar - Universal Chiplet Interconnect ExpressTM (UCIeTM): An Open Interconnect Standard for Innovations On-Package
DESCRIPTION:RE: Monthly webinar – Universal Chiplet Interconnect ExpressTM (UCIeTM): An Open Interconnect Standard for Innovations On-Package\nSpeaker: Dr. Debendra Das Sharma\, Senior Fellow\, co-GM Memory and I/O Technologies\, Intel\nDate: Monday\, August 26th\, 2024 5:00 PM (Israel Time).\nDear IEEE Israel chapter members\, Dear guests\,\nThe IEEE Computer Society Israel conducts a series of webinars in different areas of computer systems\, Software engineering\, Computer architectures\, data center\, accelerators for machine learning\, security\, and more. The webinars offer insightful and enriching talks held by international leaders and professionals of the computer society sector.\nThe next free online webinar will include a special talk “Universal Chiplet Interconnect ExpressTM (UCIeTM): An Open Interconnect Standard for Innovations On-Package” by Dr. Debendra Das Sharma\, Senior Fellow\, co-GM Memory and I/O Technologies\, Intel.\nA High-performance workloads demand on-package integration of heterogeneous processing units\, on-package memory\, and communication infrastructure such as co-packaged optics to meet the demands of the computing landscape. On-package interconnects are a critical component to deliver the power-efficient performance with the right feature set in this evolving landscape. Universal Chiplet Interconnect Express (UCIe) is an open industry standard with a fully specified stack that comprehends plug-and-play interoperability of chiplets; like the seamless interoperability on board with well-established and successful off-package interconnect standards such PCI Express® and Compute Express Link (CXL)®. In this talk\, we will discuss the usages and key metrics associated with different technology choices in UCIe and how it will evolve going forward from a planar interconnect (2D/ 2.5D) to 3D to deliver superior power-performance metrics. We will also delve into the challenges and opportunities for chiplets connected through UCIe.\nThe Webinar is free\, but pre-registration is required. So\, please sign up using this (https://technion.zoom.us/webinar/register/WN_wQ4DQaI5T8mUW_HbIcfDyA#/registration) and the Zoom session details will be provided after registration.\nPlease contact us for any further details and updates on the series of IEEE Computer Society Webinars.We are looking forward to your participation and future collaboration.\nProf. Avi Mendelson Prof. Freddy Gabbay\nAvi.mendelson@technion.ac.il freddy.gabbay@mail.huji.ac.il\nChairman Vice-Chair\nVirtual: https://events.vtools.ieee.org/m/430368
URL:https://ieee.org.il/event/webinar-universal-chiplet-interconnect-expresstm-ucietm-an-open-interconnect-standard-for-innovations-on-package/
LOCATION:Virtual: https://events.vtools.ieee.org/m/430368
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