BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//IEEE Israel Section - ECPv6.17.3.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://ieee.org.il
X-WR-CALDESC:Events for IEEE Israel Section
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:Asia/Jerusalem
BEGIN:DAYLIGHT
TZOFFSETFROM:+0200
TZOFFSETTO:+0300
TZNAME:IDT
DTSTART:20200327T000000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0300
TZOFFSETTO:+0200
TZNAME:IST
DTSTART:20201024T230000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0200
TZOFFSETTO:+0300
TZNAME:IDT
DTSTART:20210326T000000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0300
TZOFFSETTO:+0200
TZNAME:IST
DTSTART:20211030T230000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0200
TZOFFSETTO:+0300
TZNAME:IDT
DTSTART:20220325T000000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0300
TZOFFSETTO:+0200
TZNAME:IST
DTSTART:20221029T230000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20211019T110000
DTEND;TZID=Asia/Jerusalem:20211019T140000
DTSTAMP:20220610T083409Z
CREATED:20220525T132811Z
LAST-MODIFIED:20220610T083409Z
UID:1405-1634641200-1634652000@ieee.org.il
SUMMARY:"Introduction to Electronic & Microelectronic Packaging" course
DESCRIPTION:A new course with a collaboration between IEEE EPS Israel and the dept. of mechanuck enguneering in Ben Gurion University. The agenda of the course includes subjects such as: system engineering\, specs\, enviromental conditions\, adhesives\, soldering\, PCB\, thermal management\, dynamic design of electronic systems\, FEA\, screws and nuts\, microelectronic packaging and more…\nVirtual: https://events.vtools.ieee.org/m/298848
URL:https://ieee.org.il/event/introduction-to-electronic-microelectronic-packaging-course/
LOCATION:Virtual: https://events.vtools.ieee.org/m/298848
END:VEVENT
END:VCALENDAR