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SUMMARY:IEEE COMCAS 2023 - May 6\, 2023 - Summary / Paper submission deadline (Updated!)
DESCRIPTION:On behalf of the IEEE COMCAS 2023 Steering Committee\, it is our pleasure to launch the 9th International IEEE Conference on Microwaves\, Communications\, Antennas\, Biomedical Engineering and Electronic Systems (IEEE COMCAS 2023).\nIn 2023 the international IEEE COMCAS will continue to evolve and provide an advanced multidisciplinary forum for the exchange of ideas\, research results\, and industry experience in a range of key areas i.e.\, microwaves\, communications and sensors\, antennas\, biomedical engineering\, RF and microwave devices and circuits\, thermal management and electronic packaging\, signal processing and imaging\, as well as radar\, acoustics and microwave system engineering.\nIn its entirety the event includes a technical program\, industry exhibits\, and guest presentations from global experts on recent academic and industry advancements.\nIn launching the 2023 event\, we would also like to welcome you to the sunshine of the eastern Mediterranean\, in Tel Aviv. As a cosmopolitan city of stunning views and endless innovation Tel Aviv is a center that resonates with an energized atmosphere\, streets of storied history\, and an internationally recognized nightlife.\nTaking place 6-8 November 2023 in Tel Aviv\, Israel\, at the David Intercontinental Hotel by the Mediterranean Sea; IEEE COMCAS will continue a biennial series tailored to maximize professional networking\, support the candid exchange of ideas\, and develop a range of enduring opportunities.\nConference Dates: 6-8 November 2023\nVenue: David Intercontinental Hotel\, Tel Aviv\, Israel\nImportant Dates:\n– May 6\, 2023 – Proposals deadline for workshops\, short courses and tutorials\n– Updated: May 6\, 2023 – Summary / Paper submission deadline\n– Updated: July 14\, 2023 – Notification of Acceptance\n– September 4\, 2023 – Speaker's Registration deadline\n– September 4\, 2023 – Final manuscript submission\nDownload Call for Papers file (https://www.comcas.org/Portals/173/CFP-03-12-2023.pdf)\nPapers submission: (https://edas.info/N30559)\nLIST OF TOPICS\nCommunications and Sensors\nBeyond 5G – Systems & Technologies\nAI\, Machine Learning\, Deep Learning in Communications and Sensors\nBig Data in Communication Networks\nMIMO & Space-Time Coding Technologies\n5G systems & Millimeter Wave Propagation\nCognitive Radio & Spectral Sharing\nCommunications Security\nFirst Responder/Military Communications\nGreen Communication\nInternet of Things\nLong Range Low Power Networks\nMicro/Pico/Femtocell Devices and Systems\nModulation & Signal Processing Technologies\nOn-Body and Short Range Communications\nRadio over Fiber & Optical/Wireless Convergence\nSensor Networks and Technologies\nSoftware-Defined Radio & Multiple Access\nAntennas\, Propagation\, and Scattering\nAntenna Theory and Design\nSmart Antennas\, Beamforming and MIMO\nWave Propagation and Channel Modeling\nWave Scattering and RCS\nNanoEM\, Plasmonics\, and Applications\nMetamaterials\, FSS and EBG\nEM Field Theory and Numerical Techniques\nEM Interference & Compatibility\, SI\nSpectrum Management and Monitoring\nELF\, RF\, μWave\, mmW and THz Measurements\nElectronic Packaging & Thermal Management (P&TM)\nChip\, Package and PCB – Design\, Advanced Materials and Technologies\nChip & Board Level Assembly\nAdvanced Packaging – 2.5D\, 3D and Heterogenous\nIntegration\n3D Printing & Additive Manufacturing of Electronics\nElectro Photonics Packaging\nAdhesives\, Molding & Encapsulation – Materials &\nTechnologies\nSoldering & Brazing for Electronic Packaging\nBio Medical Packaging\nPlating & Coating – Materials & Technologies\nDestructive and Non-destructive Testing\nThermal Management in Electronic Systems – Methods\,\nModeling and Solutions\nConnectors\, Cables & Routing\nInspection – Technologies & Methods\nReliability in Electronic Systems\nBiomedical EngineeringBig Data in Medicine\nArtificial Intelligence\, Machine Learning\, Deep Learning\nBiomedical Systems and Applications\nAdvances in Medical Imaging Technology\nMedical RF\, MW & MMW Applications and Devices\nMedical Image Processing\nAcousto-Optic Technologies\nNovel Therapeutic Modalities\nEffects of RF and MW on Biological Tissues\nRF/MW Devices and Circuits\, RFICs\nSolid-State Devices\, RFICs\nμWave\, mmW and Sub-mmW Circuits/Technologies\nNano and THz Devices/Technologies\nMicrowave Photonics\nPassive Components and Circuits\nFilters and Multiplexers\nFerroelectrics\, RF MEMS\, MOEMS\, and NEMS\nActive Devices and Circuits\nRF Power Amplifiers and Devices\nTunable and Reconfigurable Circuits/Systems\nAnalog/Digital/Mixed RF Circuits\nCircuit Theory\, Modeling and Applications\nInterconnects\, Packaging and MCM\nCAD Techniques for Devices and Circuits\nEmerging Technologies\nInternet of Things Devices\nMicrowave Systems\, Radar\, Acoustics\nAeronautical and Space Applications\nRFID Devices/Systems/Applications\nAutomotive/Transportation Radar & Communications\nEnvironmentally Sensitive (“Green”) Design\nUWB and Multispectral Technologies & Systems\nEmerging System Architectures\nModelling Techniques for RF Systems\nRadar Techniques\, Systems and Applications\nSonar Systems and Applications\nWireless Power Transfer & Energy Harvesting\nTerahertz Systems\nAI\, Machine Learning\, Deep Learning in Microwave\, Radar\, and Acoustic Systems\nSignal Processing (SP) and Imaging\nMicrowave Imaging and Tomography\nAcoustic/Sonar Imaging and Techniques\nRadar SP and Imaging\, SAR\, ATR\nMIMO SP for Radar\nGround and Foliage Penetration Systems\nSignal Acquisition and Sensor Management\nDF\, Emitter Location\, Elint\, Array Processing\nTarget Detection\, Identification and Tracking\nData Fusion\nTime Domain and UWB SP\nAI\, Machine Learning\, Deep Learning in Signal and Image Processing\nConference Chair: Shmuel Auster\nTechnical Program Chair: Amir Boag\nWebsite: www.comcas.org\nCo-sponsored by: IEEE MTTS\, IEEE AESS\, IEEE APS\, IEEE EPS\, EuMA\, AEAI\nDAVID INTERCONTINENTAL HOTEL\, Tel Aviv\, Tel Aviv District\, Israel
URL:https://ieee.org.il/event/ieee-comcas-2023/
LOCATION:DAVID INTERCONTINENTAL HOTEL\, Tel Aviv\, Tel Aviv District\, Israel
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