IEEE Israel Section

The 11th IEEE Israel AP/MTT and Tel Aviv University Underwater Acoustics Symposium
2023-06-15 09:00 - 17:15 (Asia/Jerusalem) | Room: Rosenblatt Auditorium, Bldg: Software Engineering building, Tel Aviv University, Tel Aviv, Tel Aviv District, Israel
Dear Colleagues,
You are cordially invited to attend The 11th IEEE Israel AP/MTT Chapter and Tel Aviv University Underwater Acoustics Symposium, Thursday 15 June, 2023.
A preliminary program of the conference is attached.
Participation is free of charge, but advance registration at http://web.eng.tau.ac.il/boag/conf2/ is required.
The same link is embedded in the program.
Please spread this message.
Best regards,
Amir Boag and Or Lasri
===============================================================
Prof. Amir Boag
Department of Physical Electronics, School of Electrical Engineering
Faculty of Engineering, Tel-Aviv University
Tel-Aviv 69978, Israel
Phone: (tel:%2B972-3-6408246) E-mail: boag@tau.ac.il
Cellular: (tel:%2B972-50-9422426)
Fax: (tel:%2B972-3-6423508) URL: http://www.eng.tau.ac.il/~boag/
Agenda:
09:00-09:30 Registration & Coffee
09:30-09:40 Welcome and Opening Remarks
Prof. Noam Eliaz – Dean of the Faculty of Engineering, Prof. Amir Boag – TAU Underwater Acoustics Center
09:40-10:40 Capt. Ioannis Androulakis – MANiBUS Ltd., Greece
The Underwater Aspects of Maritime Security – Underwater Acoustics: Technologies and
Applications
10:40-11:00 Prof. Ehud Heyman – Tel Aviv University
The Spectral Theory of Transient (STT): New Directions and Canonical Integrals
11:00-11:30 Coffee Break
11:30-11:50 Iris Roger-Eitan and Dr. Anna Gleizer – Rafael
Near Field to Far Field – Numerical and Physical Methods
11:20-12:10 Dr. Evgeny Chernokozhin and Prof. Amir Boag – Tel Aviv University
Evolution of Solvers for Acoustic Scattering by Thin Elastic Shells
12:10-12:30 Dr. Lea Beilkin-Sirota – Tel Aviv University
Active Acoustic Imitation of a Rigid Object under Varying Detection Frequency
12:30-12:50 Prof. Boris Katsnelson – Haifa University
Landau-Zener Mechanism of the Waveguide Mode Coupling and its Manifestation in Shallow Water Sound
Propagation
12:50-13:50 Lunch on site (Dairy)
13:50-14:10 Azriel Sinai and Yaron Doweck – Rafael, Yair Mazal – Ben Gurion University
Real Time Control, Telemetry and Image Streaming from and to Autonomous Underwater Vehicles
14:10-14:30 Prof. Roee Diamant – Haifa University, Prof. Paolo Casari University of Trento, Italy &
Prof. Stefano Tomasin – University of Padova, Italy
Secret Key Generation from Route Propagation Delays for Underwater Acoustic Networks
14:30-14:50 Prof. Izhak Bucher, Maya Friedlander, and Ernst Uscinski – Technion
Leveraging Ultrasonic Parametric Acoustic Arrays to Manipulate External Low-Frequency Sounds
14:50-15:10 Nadav Arbel, Prof. Moshe Tur, and Prof. Avishay Eyal – Tel Aviv University
Quasi-distributed Ultrasound Sensing via an Array of Fiber Bragg Gratings
15:10–15:40 Coffee Break & Refreshments
15:40-16:00 Prof. Joseph Tabrikian – Ben-Gurion University
Optimal Model Order Selection in Normal Modes Model Using Misspecified Cramer-Rao Bound
16:00-17:00 Dr. Gil Averbuch – Woods Hole Oceanographic Institution, USA
New England Shelf Break and Seamount Acoustics
17:00 – Wine and Cheese Reception
Room: Rosenblatt Auditorium, Bldg: Software Engineering building, Tel Aviv University, Tel Aviv, Tel Aviv District, Israel

SeaAI Artificial Intelligence and Sea
2023-06-20 09:00 - 17:00 | University of Haifa, Haifa, Haifa District, Israel
The 10th edition of the Haifa conference on marine sciences will take place (in-person) on 20th of June 2023 with the theme of:
SeaAI: Artificial Intelligence and Sea. SeaAI is intended to provide a forum for research scientists, engineers, and practitioners
throughout the world to present their research findings, ideas, and applications in the areas of Artificial Intelligence and Sea.
SeaAI will include keynote speeches and invited presentations by renowned scientists and engineers.
Conference topics include:
Artificial Intelligence in Ocean Science and Technology
Emerging Sensor Technologies for Sea Applications
Sensor Data Processing and AI
Intelligent Robotic Systems
Robot sensors, vision and perception
Marine sensing and robotics
Marine Biology and AI
Underwater acoustics and sonar with AI
Marine environment, oceanography, and meteorology
Blue economy and AI
Applied Data Science and Engineering
Deep Learning
Reinforcement Learning
Transfer Learning
Computer Vision
Graph Mining
Big Data Analysis
Statistical Learning
Data Visualization
Education, Sea, and Data Science
Data Integration
University of Haifa, Haifa, Haifa District, Israel

IEEE COMCAS 2023 - May 6, 2023 - Summary / Paper submission deadline (Updated!)
2023-11-06 09:00 - 2023-11-08 17:00 | DAVID INTERCONTINENTAL HOTEL, Tel Aviv, Tel Aviv District, Israel
On behalf of the IEEE COMCAS 2023 Steering Committee, it is our pleasure to launch the 9th International IEEE Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems (IEEE COMCAS 2023).
In 2023 the international IEEE COMCAS will continue to evolve and provide an advanced multidisciplinary forum for the exchange of ideas, research results, and industry experience in a range of key areas i.e., microwaves, communications and sensors, antennas, biomedical engineering, RF and microwave devices and circuits, thermal management and electronic packaging, signal processing and imaging, as well as radar, acoustics and microwave system engineering.
In its entirety the event includes a technical program, industry exhibits, and guest presentations from global experts on recent academic and industry advancements.
In launching the 2023 event, we would also like to welcome you to the sunshine of the eastern Mediterranean, in Tel Aviv. As a cosmopolitan city of stunning views and endless innovation Tel Aviv is a center that resonates with an energized atmosphere, streets of storied history, and an internationally recognized nightlife.
Taking place 6-8 November 2023 in Tel Aviv, Israel, at the David Intercontinental Hotel by the Mediterranean Sea; IEEE COMCAS will continue a biennial series tailored to maximize professional networking, support the candid exchange of ideas, and develop a range of enduring opportunities.
Conference Dates: 6-8 November 2023
Venue: David Intercontinental Hotel, Tel Aviv, Israel
Important Dates:
– May 6, 2023 – Proposals deadline for workshops, short courses and tutorials
– Updated: May 6, 2023 – Summary / Paper submission deadline
– Updated: July 14, 2023 – Notification of Acceptance
– September 4, 2023 – Speaker's Registration deadline
– September 4, 2023 – Final manuscript submission
Download Call for Papers file (https://www.comcas.org/Portals/173/CFP-03-12-2023.pdf)
Papers submission: (https://edas.info/N30559)
LIST OF TOPICS
Communications and Sensors
Beyond 5G – Systems & Technologies
AI, Machine Learning, Deep Learning in Communications and Sensors
Big Data in Communication Networks
MIMO & Space-Time Coding Technologies
5G systems & Millimeter Wave Propagation
Cognitive Radio & Spectral Sharing
Communications Security
First Responder/Military Communications
Green Communication
Internet of Things
Long Range Low Power Networks
Micro/Pico/Femtocell Devices and Systems
Modulation & Signal Processing Technologies
On-Body and Short Range Communications
Radio over Fiber & Optical/Wireless Convergence
Sensor Networks and Technologies
Software-Defined Radio & Multiple Access
Antennas, Propagation, and Scattering
Antenna Theory and Design
Smart Antennas, Beamforming and MIMO
Wave Propagation and Channel Modeling
Wave Scattering and RCS
NanoEM, Plasmonics, and Applications
Metamaterials, FSS and EBG
EM Field Theory and Numerical Techniques
EM Interference & Compatibility, SI
Spectrum Management and Monitoring
ELF, RF, μWave, mmW and THz Measurements
Electronic Packaging & Thermal Management (P&TM)
Chip, Package and PCB – Design, Advanced Materials and Technologies
Chip & Board Level Assembly
Advanced Packaging – 2.5D, 3D and Heterogenous
Integration
3D Printing & Additive Manufacturing of Electronics
Electro Photonics Packaging
Adhesives, Molding & Encapsulation – Materials &
Technologies
Soldering & Brazing for Electronic Packaging
Bio Medical Packaging
Plating & Coating – Materials & Technologies
Destructive and Non-destructive Testing
Thermal Management in Electronic Systems – Methods,
Modeling and Solutions
Connectors, Cables & Routing
Inspection – Technologies & Methods
Reliability in Electronic Systems
Biomedical EngineeringBig Data in Medicine
Artificial Intelligence, Machine Learning, Deep Learning
Biomedical Systems and Applications
Advances in Medical Imaging Technology
Medical RF, MW & MMW Applications and Devices
Medical Image Processing
Acousto-Optic Technologies
Novel Therapeutic Modalities
Effects of RF and MW on Biological Tissues
RF/MW Devices and Circuits, RFICs
Solid-State Devices, RFICs
μWave, mmW and Sub-mmW Circuits/Technologies
Nano and THz Devices/Technologies
Microwave Photonics
Passive Components and Circuits
Filters and Multiplexers
Ferroelectrics, RF MEMS, MOEMS, and NEMS
Active Devices and Circuits
RF Power Amplifiers and Devices
Tunable and Reconfigurable Circuits/Systems
Analog/Digital/Mixed RF Circuits
Circuit Theory, Modeling and Applications
Interconnects, Packaging and MCM
CAD Techniques for Devices and Circuits
Emerging Technologies
Internet of Things Devices
Microwave Systems, Radar, Acoustics
Aeronautical and Space Applications
RFID Devices/Systems/Applications
Automotive/Transportation Radar & Communications
Environmentally Sensitive (“Green”) Design
UWB and Multispectral Technologies & Systems
Emerging System Architectures
Modelling Techniques for RF Systems
Radar Techniques, Systems and Applications
Sonar Systems and Applications
Wireless Power Transfer & Energy Harvesting
Terahertz Systems
AI, Machine Learning, Deep Learning in Microwave, Radar, and Acoustic Systems
Signal Processing (SP) and Imaging
Microwave Imaging and Tomography
Acoustic/Sonar Imaging and Techniques
Radar SP and Imaging, SAR, ATR
MIMO SP for Radar
Ground and Foliage Penetration Systems
Signal Acquisition and Sensor Management
DF, Emitter Location, Elint, Array Processing
Target Detection, Identification and Tracking
Data Fusion
Time Domain and UWB SP
AI, Machine Learning, Deep Learning in Signal and Image Processing
Conference Chair: Shmuel Auster
Technical Program Chair: Amir Boag
Website: www.comcas.org
Co-sponsored by: IEEE MTTS, IEEE AESS, IEEE APS, IEEE EPS, EuMA, AEAI
DAVID INTERCONTINENTAL HOTEL, Tel Aviv, Tel Aviv District, Israel

Chiplet approaches to scale up and scale out machine learning computation, Prof. Zhengya Zhang, University of Michigan, Ann Arbor
2023-12-07 16:00 - 17:30 | Virtual: https://events.vtools.ieee.org/m/387202
Abstract
Neural network (NN) models are rapidly increasing in size and complexity, surpassing the pace of NN chip upgrades. The development of monolithic chips to match these evolving models is both expensive and challenging. Alternatively, modular chiplets can be designed and reused to create multi-chip packages (MCPs) capable of addressing diverse NN models and tasks. The future success of chiplet technology hinges on advancements in chiplets that offer high utilization and flexibility, efficient high-bandwidth die-to-die interfaces, and high-density packaging. In this presentation, I will introduce two MCPs resulting from our collaboration with Intel and the Institute of Microelectronics in Singapore. The first MCP, NetFlex, integrates four NN chiplets using high-density fan-out wafer level packaging (HD-FOWLP). NetFlex’s flexible chiplet design and lightweight die-to-die interface enable scalability for larger configurations. The second MCP, Arvon, utilizes Embedded Multi-die Interconnect Bridge (EMIB) to integrate an FPGA chiplet and two DSP chiplets. Arvon is a programmable MCP that supports various workloads, including NN and communication signal processing. Its flexibility allows for scalability to accommodate evolving workloads over time.
Bio
Zhengya Zhang received the B.A.Sc. degree from the University of Waterloo in 2003, and the M.S. and Ph.D. degrees from UC Berkeley in 2005 and 2009, respectively. Since 2009, he has been with the Department of Electrical Engineering and Computer Science at the University of Michigan, Ann Arbor, where he is currently a full professor. His research primarily focuses on low-power and high-performance VLSI circuits and systems, with applications in computing, communications, and signal processing. Dr. Zhang was a recipient of the NSF CAREER Award, the Intel Early Career Faculty Award, the University of Michigan Neil Van Eenam Memorial Award, and the David J. Sakrison Memorial Prize from UC Berkeley. He serves as an IEEE Solid-State Circuits Society Distinguished Lecturer.
Virtual: https://events.vtools.ieee.org/m/387202

On-chip Engineering
2024-03-06 09:00 - 11:00 | Eshel, Southern District, Israel
A system-on-a-chip or system-on-chip is an integrated circuit that integrates most or all components of a computer or other electronic system. During the lecture, the system on chip will be overviewed followed by the experimental demonstrations.
Co-sponsored by: Prof Alina Karabchevsky
Eshel, Southern District, Israel

Accelerating Time to Tapeout - 6 reasons to utilize the cloud
2024-03-19 16:30 - 18:00 | Virtual: https://events.vtools.ieee.org/m/409166
In recent years EDA is shifting more and more to the AWS cloud to accelerate time to tapeout, with companies like Arm, NXP and Marvell openly speaking about their cloud adoption journey. In this session we cover the 6 reasons companies are moving EDA to AWS, as well as the the latest announcements made by EDA tool providers to enable customers to do more with the same engineering staff in the cloud.
Speaker(s): Ronen Laviv,
Virtual: https://events.vtools.ieee.org/m/409166

Full day Seminar on electro-mechanical connectors
2024-04-11 08:30 - 16:00 | מכון מופ"ת, שושנה פרסיץ 13, תל-אביב, Tel Aviv, Tel Aviv District, Israel
הסניף הישראלי של IEEE Electronic Packaging Society וענף זיווד אלקטרוני ומיקרואלקטרוני בלשכת המהנדסים והאדריכלים,
מזמינים אתכם/ן לקחת חלק ביום עיון שיעסוק במחברים אלקטרו-מכאניים.
יום חמישי |11.4.2024| 08:30-16:00| מכון מופ"ת, שושנה פרסיץ 13, תל-אביב
מהנדסי והנדסאי מכונות וחשמל אינם לומדים על מחברים אלקטרו-מכאניים במסגרת הלימודים. בפועל רבים מהעוסקים בתכנון אלקטרו-מכני נדרשים לאפיין ולתכנן את סוגי המחברים שישבו על הלוח, יחוברו לצמות, ימוקמו בתוך הקופסא או מחוץ לקופסא.
הצטרפו אלינו ליום עיון שבו תוכלו ללמוד ולשמוע ביום מרוכז אחד מגוון תכנים חשובים ושימושיים, הקשורים לעולם המחברים האלקטרו-מכאניים.
מידע חשוב מפי מומחים*
* הזדמנות למפגש עם קולגות מהתחום*
* ארוחת צהרים קלה*
מכון מופ"ת, שושנה פרסיץ 13, תל-אביב, Tel Aviv, Tel Aviv District, Israel

IEEE Israel - 2024 General Assembly, 7.5.2024
2024-05-07 16:30 - 18:15 | Virtual: https://events.vtools.ieee.org/m/416156
חבר/ת IEEE ישראל יקר/ה,
אני מתכבד להזמין אותך לאסיפה הכללית לשנת 2024 של הארגון, אשר תתקיים באופן מקוון באמצעות ZOOM ביום שלישי, 7.5.2024.
האסיפה תפתח להצטרפות החל משעה 16:30, ותתקיים בכל מספר נוכחים החל משעה 17:00.
האסיפה הכללית היא המוסד העליון של העמותה והיא מתכנסת לפחות אחת לשנה. האספה תדון בנושאים שעל סדר היום.
ניתן להוסיף נושאים לסדר היום במהלך האספה ובלבד שהוחלט על כך בהצבעה.
חבר הרשום כפעיל ב- IEEE ביום האסיפה בשנת 2024 ואשר נוכח בהצבעה זכאי להצביע.
על סדר היום:
· בחירת יו"ר ומזכיר לאסיפה כללית זו
· דו"ח היו"ר שמואל אוסטר
· דו"ח כספי לשנת 2023 – שמואל אוסטר ורואה החשבון גיל משיח
· דו"ח ועדת ביקורת על הדו"חות הכספיים: רפי הוידה ואיתי דברן
· אישור דו"חות כספיים לשנת 2023 ותקציב ל- 2024.
· אישור מינוי רו"ח וחברי ועדת הביקורת.
· נושאים שונים שיועלו ע"י הנוכחים.
הנך מתבקש.ת להירשם ולמלא את פרטיך באמצעות הקישור:
https://aeai-org-il.zoom.us/webinar/register/WN_FNbhE8q-RvaD_Vfiw5eHIQ
לאחר שתסיים.י את הליך הרישום, המערכת תשלח אליך באופן אוטומטי במייל (לכתובת הדוא"ל שרשמת) את הזימון (קישור) לפגישה.
יש לעשות שימוש בקישור זה להתחברות ביום האספה.
בברכה,
שמואל אוסטר
יו"ר IEEE סניף ישראל
Chair, IEEE Israel Section
הקישור להרשמה:
https://aeai-org-il.zoom.us/webinar/register/WN_FNbhE8q-RvaD_Vfiw5eHIQ
אם הקישור משתבש, יש להעתיק את הכתובת לבראוזר, וזה עובד.
Virtual: https://events.vtools.ieee.org/m/416156

100-300 GHz Wireless: transistors, ICs, systems - Prof. Mark Rodwell, University of California, Santa Barbara
2024-05-08 17:00 - 18:30 | Virtual: https://events.vtools.ieee.org/m/419492
Biography
Mark Rodwell holds the Doluca Family Endowed Chair in Electrical and Computer Engineering at UCSB and directs the SRC/DARPA Center for Converged TeraHertz Communications and Sensing. His research group develops nm and THz transistors, and high-frequency integrated circuits and systems. Prof. Rodwell received the 2010 IEEE Sarnoff Award, the 2012 Marconi Prize Paper Award, the 1997 IEEE Microwave Prize, the 2009 IEEE IPRM Conference Award, and the 1998 European Microwave Conference Microwave Prize.
Abstract
We describe the opportunities, and the research challenges, presented in the development of 100-300GHz wireless communications and imaging systems. In such links, short wavelengths permit massive spatial multiplexing both for network nodes and point-point links, permitting aggregate transmission capacities approaching 1Tb/s. 100-300GHz radar imaging systems can provide thousands of image pixels and sub-degree angular resolution from small apertures, supporting foul-weather driving and aviation. Challenges include the mm-wave IC designs, the physical design of the front-end modules, the complexity of the back-end digital beamformer required for spatial multiplexing, and, for imaging, the development of system architectures requiring far fewer RF channels than the number of image pixels. We will describe transistor development, IC design, and system design, and describe our efforts to develop 140GHz massive MIMO wireless hubs, and 210GHz and 280GHz MIMO backhaul links.
Virtual: https://events.vtools.ieee.org/m/419492

RE: Monthly webinar – Automotive: Transitioning to Centralized Architectures
2024-05-19 16:19 - 17:30 | Virtual: https://events.vtools.ieee.org/m/418799
RE: Monthly webinar – Automotive: Transitioning to Centralized Architectures
Speaker: Mr. Moshe Anschel, Technical Fellow at General Motors
Date: Sunday, May 19th, 2024 4:30 PM (Israel Time).
Dear IEEE Israel chapter members, Dear guests,
The IEEE Computer Society Israel conducts a series of webinars in different areas of computer systems, Software engineering, Computer architectures, data center, accelerators for machine learning, security, and more. The webinars offer insightful and enriching talks held by international leaders and professionals of the computer society sector.
The next free online webinar will include a special talk “Automotive: Transitioning to Centralized Architectures” by Mr. Moshe Anschel, Technical Fellow at General Motors.
A New Era for Software-Defined Vehicles: This presentation will explore the latest architectural shifts in the realm of software-defined vehicles, particularly the transition from distributed to centralized architectures. We will provide a high-level overview of the hardware central computer and discuss the emerging silicon trends influencing these centralized computer architectures. Additionally, we will delve into the deployment of software on these SoCs. Join us as we navigate the evolving landscape of vehicle hardware and software and envision the future of automotive technology.
The Webinar is free, but pre-registration is required. So, please sign up using this (https://technion.zoom.us/webinar/register/WN_57Ts8TMOSjKCMGemozPKyg#/registration) and the Zoom session details will be provided after registration.
Please contact us for any further details and updates on the series of IEEE Computer Society Webinars.We are looking forward to your participation and future collaboration.
Prof. Avi Mendelson Prof. Freddy Gabbay
Avi.mendelson@technion.ac.il freddy.gabbay@mail.huji.ac.il
Chairman Vice-Chair
Co-sponsored by: Freddy Gabbay
Virtual: https://events.vtools.ieee.org/m/418799

הכנס הבינלאומי - INCOSE IL 2024 - הנדסת מערכות בעידן ה-AI - מגמות ויישומים
2024-06-03 13:40 - 2024-06-04 13:42 | Bldg: Daniel Herzliya Hotel, 60 Ramat Yam St, Herzliya, Central District, Israel, 46851
האיגוד הישראלי להנדסת מערכות (INCOSE-IL) מזמין נציגים ועמיתים מארגוניכם להשתתף בכנס השנתי – הנדסת מערכות בעידן ה-AI שייערך ב- 3.6.2024 במלון דניאל בהרצליה. ביום שלישי ה-4.6.2024 נקיים יום של סדנאות באופן מקוון בהשתתפות מרצים מהארץ ומחו"ל.
הכנס השנה הינו הזדמנות לשתף אוכלוסיות רחבות מהתעשייה והאקדמיה בנושאי הנדסת מערכות וליצור בעקבותיו היכרויות בין העוסקים בהנדסת מערכות, להרחיב את השת"פ תעשייה – אקדמיה, להתעדכן בכלים ושיטות ולהרחיב ולהעמיק את העשייה בגישה של הנדסת מערכות.
מטרות הכנס
התפתחות הדיגיטציה והאוטומציה בעולם בכלל ובעולם הטכנולוגי בפרט יצרה הזדמנויות לצד אתגרים : תחלופה ותזזיתיות בשוק העבודה אל מול ההסתגלות ליכולת השפעה בו זמנית מנקודות שונות על הגלובוס. מגוון עצום של יכולות ויישומים בתחום הבינה המלאכותית והתקדמות משמעותית בפיתוח מערכות אוטונומיות.
הכנס יעסוק בנושאים אלה לצורך מינוף והשפעה על נקודת העבודה, על היכולת להתך ולקבל החלטה על סמך מידע שונה ומגוון. נעסוק בשאלה כיצד נדע שהמידע מהימן ואיך יכולות ויישומי ה-AI יתרמו לנו בפיתוח המערכות. בכנס יוצגו דרכים ושיטות לשימוש במידע שנאסף לאורך תהליכי הפיתוח, הבדיקות והניסויים כדי להגיע לבשלות תכן גבוהה, לאספקת מערכות אמינות ללקוחות וזאת בזמן קצר הרבה יותר.
נושאים מרכזיים בהם יעסוק הכנס:
– היכרות עם הנדסת מערכת דיגיטלית, מערכות אוטונומיות, כלים ושיטות לקבלת החלטות ושילובם במערכות.
– שימוש ויישום AI באקדמיה ובתעשיות לאורך מחזור חיים שלם.
– יישומי בינה מלאכותית במערכות אוטונומיות.
– בינה מלאכותית ככלי תומך בקבלת החלטות.
– איסוף מידע במהלך הפיתוח, האימות, התיקוף והניסויים להגדלת אמינות המערכות בשלב המסירה.
הכנס יכלול:
– הרצאות פתיחה שיעסקו בסקירה ויישום בולט של בינה מלאכותית בהנדסת מערכת בתעשיות "הגדולות" והקלאסיות ובתעשיות "הזריזות" (דוגמת סטארט-אפים).
– שני מסלולים מקבילים, בכל מסלול יהיו שלושה מושבים.
– בסיום הכנס נקיים פנל מומחים בנושא מה נוכל ללמוד מהמערכות האוטונומיות וכיצד ניתן לשכלל את יכולות הנדסת המערכות האנושיות.
– כחלק בלתי נפרד מהכנס נקיים תצוגת פוסטרים של פרויקטי גמר של סטודנטים לתואר שני בהנדסת מערכות מהמוסדות האקדמיים בארץ.
– הכנס יכלול יום סדנאות בזום בהשתתפות מומחים מהארץ ומחו"ל.
Co-sponsored by: Israeli Systems Engineering Association – INCOSE IL
Agenda:
תכנית הכנס:
יום הכנס – 3 ביוני 2024 – https://www.incoseil.org/activity_page/incoseil2024/assets/INCOSEIL2024.DAY1-Program.pdf
יום הסדנאות – 4 ביוני 2024 – https://www.incoseil.org/activity_page/incoseil2024/assets/INCOSEIL2024.DAY2-Program.pdf
Bldg: Daniel Herzliya Hotel, 60 Ramat Yam St, Herzliya, Central District, Israel, 46851

The 4th Annual & Students Conference of the Israeli Smart Transportation Research Center
2024-06-27 18:07 - 18:09 | Bldg: 70, Ben gurion University, BEER-SHEVA, Southern District, Israel, 84105
Resilience to Disruption and Disaster
The 4th Annual & Students Conference of the Israeli Smart Transportation Research Center
Co-sponsored by: ISTRC, BGU
Agenda:
Program Overview
The conference will be held at Senate Hall, Building 71
09:15-09:45 Registration
10:45-11:15 Greetings and Intro
– Prof. Raz Jelinek, VP and Dean for Research and Development
– Tchiya Allon, General Manager of The Israeli Smart Transportation Research Center
– Prof. Eran Ben-Elia, Head of BGU CITI Center for Intelligent Transportation & Innovation
10:15-11:15 Keynote Prof. Yoram Shiftan – ISTRC head
From restoration to resilience – can technology recover transportation systems?
11:15-11:30 Coffee Break
11:30-13:00 Session 1- Parallel Sessions
Autonomous Vehicles
Barkan Hall(building 70)
Chair – Prof. Igal Bilik
Public Transport & shared mobility
Senate Hall(building 71)
Chair – Prof. Eran Ben-Elia
13:00-14:00 Lunch & Formula Exposition
13:45-14:45 Poster Session
14:45-15:30 Session 2 – Parallel Sessions
Algorithms, optimization, and big
data
Barkan Hall(building 70)
Chair – Prof. Hillel Bar-Gerahttps://lp.vp4.me/tzw8
Road users: safety, health & ethics
Senate Hall(building 71)
Chair – Prof. Tal Oron Gilad
15:30-15:45 Coffee Break
15:45-16:50 Panel Discussion – Resilience to Disruption Is smart transportation the solution?
Prof. David Shinar, Department of Industrial Engineering and Management
16:50-17:15 Prizes and Concluding Remarks
Prof. Eran Ben-Elia, Head of BGU CITI Center for Intelligent Transportation & Innovation
Bldg: 70, Ben gurion University, BEER-SHEVA, Southern District, Israel, 84105

Webinar - Universal Chiplet Interconnect ExpressTM (UCIeTM): An Open Interconnect Standard for Innovations On-Package
2024-08-26 17:00 - 18:00 | Virtual: https://events.vtools.ieee.org/m/430368
RE: Monthly webinar – Universal Chiplet Interconnect ExpressTM (UCIeTM): An Open Interconnect Standard for Innovations On-Package
Speaker: Dr. Debendra Das Sharma, Senior Fellow, co-GM Memory and I/O Technologies, Intel
Date: Monday, August 26th, 2024 5:00 PM (Israel Time).
Dear IEEE Israel chapter members, Dear guests,
The IEEE Computer Society Israel conducts a series of webinars in different areas of computer systems, Software engineering, Computer architectures, data center, accelerators for machine learning, security, and more. The webinars offer insightful and enriching talks held by international leaders and professionals of the computer society sector.
The next free online webinar will include a special talk “Universal Chiplet Interconnect ExpressTM (UCIeTM): An Open Interconnect Standard for Innovations On-Package” by Dr. Debendra Das Sharma, Senior Fellow, co-GM Memory and I/O Technologies, Intel.
A High-performance workloads demand on-package integration of heterogeneous processing units, on-package memory, and communication infrastructure such as co-packaged optics to meet the demands of the computing landscape. On-package interconnects are a critical component to deliver the power-efficient performance with the right feature set in this evolving landscape. Universal Chiplet Interconnect Express (UCIe) is an open industry standard with a fully specified stack that comprehends plug-and-play interoperability of chiplets; like the seamless interoperability on board with well-established and successful off-package interconnect standards such PCI Express® and Compute Express Link (CXL)®. In this talk, we will discuss the usages and key metrics associated with different technology choices in UCIe and how it will evolve going forward from a planar interconnect (2D/ 2.5D) to 3D to deliver superior power-performance metrics. We will also delve into the challenges and opportunities for chiplets connected through UCIe.
The Webinar is free, but pre-registration is required. So, please sign up using this (https://technion.zoom.us/webinar/register/WN_wQ4DQaI5T8mUW_HbIcfDyA#/registration) and the Zoom session details will be provided after registration.
Please contact us for any further details and updates on the series of IEEE Computer Society Webinars.We are looking forward to your participation and future collaboration.
Prof. Avi Mendelson Prof. Freddy Gabbay
Avi.mendelson@technion.ac.il freddy.gabbay@mail.huji.ac.il
Chairman Vice-Chair
Virtual: https://events.vtools.ieee.org/m/430368

VCSEL Consortium Annual Meeting
2024-09-04 09:00 - 17:45 | Bldg: Institute for National Security Studies (INSS), Chaim Levanon St 40, Tel Aviv-Yafo, Tel Aviv, Tel Aviv District, Israel
You are cordially invited to the annual meeting highlighting the VCSEL Consortium achievements by the Consortium members including two lectures by prominent guest scientists in the field.
Co-sponsored by: Israel Innovation Authority
Agenda:
08:30-09:00 Get together
09:00-09:30 Introduction:
Dr. Yehoshua Kalisky, Technical Manager
Dr. Yoram Karny, Chairman of the Cosortium
Greetings:
Dr. Ilan Steiner, Chief Finance and Operations Officer, INSS
Mr. Moshe Avrahami, Consortia Incentive Program, Technological Infrastructure Division
09:30-10:30 Professor Dr. Dieter Bimberg, CIOMP, Chinese Academy of Sciences and Technical University Berlin, "Energy efficiency of optical communication in data centers"
10:30-11:00 Professor Gadi Eisenstein, PI, Technion, "On the relationship between electrical and electro-optical properties of VCSEL's"
11:00-11:30 Professor Meir Orenstein, Technion, "Modes and Complexity in VCSELs"
11:30-11:45 Coffee break
11:45-12:15 Dr. Dan Yanson, Senior Principal Scientist, SCD SemiConductor Devices, "An (in)coherent story of developing coherent VCSEL arrays at SCD"
12:15-12:45 Professor Dan Marom, Hebrew University, "VCSEL source array spatial multiplexing with Photonic Lanterns"
12:45-13:15 Dr. Yuri Berk, Sr. Staff Engineer, Nvidia, "GaAs-based VCSELs for Rb-Atomic Clock and optical transceivers”
13:15-13:45 Lunch break
13:45-14:15 Dr. Yoel Sabag, Head of Phys. Dept., AccuBeat, "VCSEL characterization for atomic clock based on CPT (coherent population trapping) technology"
14:15-14:45 Natan Kaplan, CTO, Holo/Or, ‘’High power laser beam shaping – review of selected laser material processing applications ‘’
14:45-15:15 Dr. Inbar Dag Hartman, VP R&D, Phononics, "Integration of Diamond Heat Spreaders to VCSEL GaAs Substrates"
15:15-15:30 Coffee break
15:30-16:00 Eitan Neeman, Advanced EMS Director, INPACK-Advanced packaging, "VECSEL assembly process & heat management solutions"
16:00-16:30 Eng. Ariel Roizman, Project Manager, Civan Advanced Technologies, "Applications of coherent VCSELs for CBC"
16:30-17:15 Professor Kent D. Choquette, Electrical and Computer Engineering Department, University of Illinois Urbana, IL 61802 (by zoom), "VCSEL Mode Engineering"
17:15-17:45 Dr. Yonatan Plotnik (C/O Professor Moti Segev), Technion), "Photonics in Time-Varying Media"
Bldg: Institute for National Security Studies (INSS), Chaim Levanon St 40, Tel Aviv-Yafo, Tel Aviv, Tel Aviv District, Israel

New Trends and Developments in the World of Photonics
2024-09-23 10:30 - 14:00 | Bldg: Yavne Cultural Center, Olesh 1, Yavne, Tel Aviv District, Israel
SOREQ/ISORAD and Photonics Israel invite engineers and scientists from the photonics industry and academia to attend the conference and participate in a tour of the Israel Center for Advanced Photonics' Lab.
Co-sponsored by: Israel Center for Advanced Photonics (ACAP)
Speaker(s): Lutz Aschke, Alon Stopel, Ohad Zohar
Agenda:
[]
Bldg: Yavne Cultural Center, Olesh 1, Yavne, Tel Aviv District, Israel

הפחתת רעשים בכרטיסים אלקטרונים
2024-11-12 16:00 - 17:10 | Virtual: https://events.vtools.ieee.org/m/438854
IEEE EMC & SI, PI Israel
ואיגוד מהנדסי האלקטרוניקה בלשכת המהנדסים
מזמינים לוובינר ללא עלות בנושא:
הפחתת רעשים בכרטיסים אלקטרונים: כלים וגישות מתקדמות ל Board Design
פליטה אלקטרו-מגנטית מכרטיס אלקטרוני, נבדקת עפ”י תקנים אזרחיים /צבאיים, ומהווה אתגר, למתכנן המעגלים במיוחד ככל שקצבי התקשורת עולים, היעילות האנרגטית עולה, ואילוצי מקום ותכן קשוחים יותר.
אתגר גדול יותר הוא תכנון מערכות המשלבות סנסורים RF’ ים, בקרבה לרכיבים דיגיטליים. פגיעה ברגישות הקליטה של החלק ה- RF היא פועל יוצא של פליטה אלקטרו-מגנטית לא רצונית מהפעילות הדיגיטלית בקרבה.
לפיכך, הבנה ושליטה על מנגנוני הרעש בכרטיס, נדרשת מכל Board Designer
בוובינר נסקור את השיטות והכלים המתקדמים ביותר, להתמודדות עם האתגרים הללו.
להרשמה ללא עלות>> https://www.aeai.org.il/activity/noise-reduction-webiner/
עידית שפר | מנהלת איגודים
לפעילויות הלשכה (https://www.aeai.org.il/activity/?sign)
משרד 03.5205818 | פקס 03.5272496
Virtual: https://events.vtools.ieee.org/m/438854

Efficient Hardware Implementation of Deep Learning Computation and its Application - Prof. Seokbum Ko, University of Saskatchewan, Canada
2024-11-20 17:30 - 19:00 | Virtual: https://events.vtools.ieee.org/m/446950
Abstract:
Deep learning can provide superior performance in many fields of applications. However, the cost of implementing deep learning models in practical applications is expensive. Deep learning models are both computation intensive and memory intensive. Computation is an important aspect for deep learning. It can determine the latency that is how fast the results can be obtained. In this seminar, computer arithmetic for deep learning will be discussed. This lecture will start with discussing the computation requirements of deep learning models and layers. Then, several computer arithmetic designs for deep learning in the literature will be used as examples. Finally, future trends of computer arithmetic for deep learning computation will be discussed.
Posit is designed as an alternative to IEEE 754 floating-point format for many applications. It has non-uniformed number distribution, and it can provide a much larger dynamic range than IEEE floating-point format. These make posit especially suitable for deep learning applications. In recent years, more and more posit based deep learning hardware accelerators appear in the literature. In this lecture, the basics of posit format and the corresponding posit-based arithmetic units available in the literature, including adder, multiplier, multiply-accumulate unit, and quire operator, will be discussed. Then, several posit-based deep learning processors for deep learning inference and training will be discussed. Finally, the trends and challenges of posit arithmetic units and posit based deep learning processors will be discussed to motivate more related research works.
Deep learning applications will be shared with the audience.
Bio:
Seokbum Ko is currently a Professor at the Department of Electrical and Computer Engineering and the Division of Biomedical Engineering, University of Saskatchewan, Canada. He received his PhD from the University of Rhode Island, USA in 2002.
His areas of research interest include computer architecture/arithmetic, efficient hardware implementation of compute-intensive applications, deep learning processor architecture and biomedical engineering.
He is an IEEE Cicuits and Systems Society Distinguished Lecturer (2024-2025), a senior member of IEEE circuits and systems society and an associate editor for IEEE TVLSI, IEEE TCAS-II, IEEE Access and IET Computers & Digital Techniques. He is an active member of IEEE CAS Technical Committee, IEEE P3109, IEEE754-2029, IEEE Domain-Specific Accelerators Standarads Committee and IEEE Emerging Processor Systems Standards Committee. He was an associate editor for IEEE TCASI (2019-2021).
The webinar is free but registration is required.
Zoom link will be sent after registration.
Virtual: https://events.vtools.ieee.org/m/446950

IEEE Photonics Society Distinguished Lecturer, Daniel Renner: Monolithic, Heterogeneous and Hybrid Photonic Integration
2024-11-25 11:30 - 12:30 | Room: 329 (third floor), Bldg: Engineering Building, Bar Ilan University, Ramat Gan, Tel Aviv District, Israel
Photonic integration has been at the center of photonic activity for several years. Over this period, great strides have been made to increase the integration density and integrated chip functionality. This talk will work its way up from the drivers for photonic integration – why do we need Photonic Integrated Circuits (PICs)? What are their similarities and differences with Electronic Integrated Circuits (EICs)? This analysis of integration drivers will lead to a discussion of recent progress on the main paths: monolithic, heterogeneous and hybrid. The talk will conclude with possible approaches to meet the additional demanding considerations for future Quantum PICs.
Speaker(s): , Daniel
Room: 329 (third floor), Bldg: Engineering Building, Bar Ilan University, Ramat Gan, Tel Aviv District, Israel

Batteries not Included: Circuits and Systems that Sense and Self-Power - Prof. Matthew Johnston, Oregon State University
2024-12-04 18:00 - 19:30 | Virtual: https://events.vtools.ieee.org/m/448413
Abstract:
Future wearable devices and other deployed sensor systems, including smart agriculture or environmental monitoring, will require new approaches for long-term powering and operation that avoid individual battery recharging. One approach is the use of thermoelectric energy harvesting, where energy is extracted from thermal gradients using a solid-state thermoelectric generator (TEG). Even centimeter-scale TEGs can provide microwatts of power from small temperature gradients, such as body heat, but they present a number of challenges in terms of low-voltage, highly-efficient energy conversion at the output.
In this talk, I will present recent work in low-voltage energy harvesting applied to wearable devices, including some of our own low-level improvements in DC-DC converters and complete thermoelectric energy harvesting solutions – including true battery-less, wearable bioelectronic sensors powered by body heat. I will also present a number of ultra-low-power (ULP) sensor readout interface circuit approaches that enable ULP (<10µW) read-out for resistive-, voltage-, and current-domain sensors, such as temperature, pH, and electrochemical reactions. Together, thermoelectric energy harvesting combined with ULP sensors and read-out ICs are a promising avenue for powering wearable devices using body-heat energy harvesting.
Bio:
Matthew Johnston received the B.S. degree in electrical engineering from the California Institute of Technology in 2005, and the M.S. and Ph.D. degrees in electrical engineering from Columbia University in 2006 and 2012. He was a Co-Founder and Manager of Research with Helixis, Carlsbad, CA, a Caltech-based spinout developing instrumentation for real-time PCR, from 2007 to its acquisition by Illumina in 2010. From 2012 to 2013, he was a postdoctoral scholar with the Bioelectronic Systems Lab at Columbia University. He also worked as an Associate at a life sciences venture capital firm in New York City.
Dr. Johnston joined Oregon State University in 2014, where he is currently an Associate Professor with the School of Electrical Engineering and Computer Science. His current research interests include the integration of sensors and transducers with silicon CMOS integrated circuits, lab-on-CMOS platforms, ultra-low-power sensor electronics, stretchable circuits and systems, bio-energy harvesting, and low-power distributed sensing.
Dr. Johnston was the recipient of the 2020 Semiconductor Research Corporation (SRC) Young Faculty Award, the 2021 Oregon State University College of Engineering Faculty Teaching Excellence Award, and the 2021 Oregon State University Provost Fellowship. He is currently an Associate Editor of the IEEE Transactions on Circuits and Systems II, and he has also served as an Associate Editor for the IEEE Open Journal of Circuits and Systems and the IEEE Transactions on Biomedical Circuits and Systems.
The webinar is free but registration is required. Zoom link will be sent after registration.
Virtual: https://events.vtools.ieee.org/m/448413

Antennas Symposium
2024-12-19 09:00 - 17:20 | Room: Auditorium 001, Bldg: Broadcom Building, Faculty of Engineering Tel Aviv University, Tel Aviv, Tel Aviv District, Israel
Dear Colleagues,
You are cordially invited to attend The 12th Tel Aviv University Antenna Symposium on Thursday, December 19, 2024.
The conference program is attached.
Participation is free of charge, but advanced registration at https://boag.sites.tau.ac.il/antenna-symposium-registration is required.
The same link is embedded in the program.
Please spread this message.
Best regards,
Yakir Hadad and Amir Boag
============================================================
Prof. Amir Boag
Department of Physical Electronics, School of Electrical Engineering
Faculty of Engineering, Tel Aviv University
Tel Aviv 69978, Israel
Phone: (tel:%2B972-3-6408246) E-mail: boag@tau.ac.il
Cellular: (tel:%2B972-50-9422426)
Fax: (tel:%2B972-3-6423508) URL: https://boag.sites.tau.ac.il/
Agenda:
[]
Registration & Coffee
Welcome, and Opening Remarks Amir Boag, Yakir Hadad,
Davide Tallini – EuroMED SIMULIA, Non-parametric Shape Optimization of a Horn Antenna Feed Chain,
Dr. Amir Shlivinski – BGU, Prof. Yakir Hadad – TAU, Universal Pulsed Radiation by Temporal Transition in Open Guiding Structures,
Prof. Amir Boag, Fast Time Domain Algorithms
Prof. Ehud Heyman – TAU, Dr. Michael Katsav – Rafael, Beam Diffraction by an Impedance Wedge: Exact and Uniform Asymptotic Solutions, and Phenomenology,
Prof. Reuven Shavit and Michael Elman- BGU, Metasurface Conformal Radomes with Printed Elements,
Prof. Eitan Bachmat – BGU, Wave Propagation: a Multidisciplinary Approach
Lunch on site
Dr. Yarden Mazor – TAU, Characterizing the Electric Properties of Scatterers in a Homogeneous Environment Using an Open-Ended
Coaxial Probe
A. Shaham, B.-Z. Joselson, I. Varenisov, D. Dikarov, and Prof. Ariel Epstein – Technion, Temporal Wood’s Anomaly in Folded Time Gratings
Prof. Pavel Ginzburg, et al. – TAU and Rafael, Drone Tagging with Superscatterers
Roee Geva, Prof. Mário Silveirinha and Prof. Raphael Kastner – TAU and Universidade de Lisboa, Polarization Control with PTD-Symmetric Metasurfaces
Prof. Yakir Hadad and Koffi Emanuel Sadzi – TAU, Modeling the Particle in a Cavity Problem Using Polarizability Theory
Coffee Break & Refreshments
Dr. Cosme Culotta-López, et al. – Orbit/FR (MVG), Parallax Compensation in Offset-Mounted Spherical Near-Field Vehicular Antenna Measurements With Probe Effects for FFT-Based NFFFTs
Dr. Lea Beilkin et al. – Unidirectional Solitons in Nonlinear Electric Circuit Metamaterials
Vladimir Vulfin – EM Infinity and Prof. Reuven Shavit – BGU, Scattering Analysis of Two Metal Beams with Rectangular Cross Section and Arbitrary Orientation
Omry Oren, Matar Eliaz and Prof. Eran Socher – TAU, Controlling Beam Steering of THz CMOS DRAs Using 2D Multiport Excitation
Dr. Erez Gershnabel – IAI, Nanophotonics and metamaterials
Prof. Timor Melamed – BGU, Applying Beam Methods for the Design of Curved Pulsed Beams
Wine and Cheese Reception
Room: Auditorium 001, Bldg: Broadcom Building, Faculty of Engineering Tel Aviv University, Tel Aviv, Tel Aviv District, Israel

Oceanic Engineering Meetup
2025-01-21 16:00 - 18:30 | Room: Room 223, Bldg: Multi-purpose building, Abba Khoushy Ave 199, Haifa, Haifa District, Israel
🌊 Join Us for the first IEEE OES student event in Israel! 🌊
The IEEE OES Student Chapter Branch at the (https://www.linkedin.com/company/university-of-haifa/) is excited to host the Oceanic Engineering Meetup, the first-ever OES student event in Israel.
📅 Date: January 21st, 2025
⏰ Time: 16:00-18:30
📍 Location: University of Haifa, Multi-purpose building, Room 223
Discover the latest advancements in marine and environmental technologies through talks by:
🔹 Samuel Cohen: Autonomous surface vehicle navigation algorithm validations.
🔹 Tom Aviksis Cohen: AI-powered oil spill detection using multisource technologies.
🔹 Zeev Yampolsky: Data-driven frameworks for DVL calibration.
🔹 Haitham Ezzy: Linking reef habitat features and fish diversity with 3D metrics.
🔹 Daniel Engelsman: Learning-based gyrocompassing.
🔹 Netta Palez & Gal Versano: Preparing ARIEL for AUV competition and research.
✨ Don’t miss the robotic exhibition and an opportunity to network over light refreshments.
Be part of this exciting milestone for IEEE OES in Israel—see you there!
Co-sponsored by: Nadav Cohen
Room: Room 223, Bldg: Multi-purpose building, Abba Khoushy Ave 199, Haifa, Haifa District, Israel

Technion CTF Team - End-of-Semester Competition
2025-01-28 18:30 - 20:00 | Room: #6 & #8, Bldg: Taub, Technion City, Haifa, Haifa District, Israel
Hello everyone!
The Technion's CTF group – **Technipwn** – is excited to announce the **End-of-Semester Competition**, in collaboration with Intel, which will take place this **Tuesday, January 28th, at 6:30 PM** in the **Taub Building**.
The competition will be held in teams of 2-3 participants, so you can either come with a team in advance or form one during the event.
The challenges will cover topics learned throughout the semester, including **web, binary exploitation, crypto, and forensics** 👾
And of course, there will be **prizes for the winners** 🏅
**Register for the competition here (limited spots):**
(https://forms.gle/g6txmfPWuQTMCp7s8)
See you at the competition! 🏆
Room: #6 & #8, Bldg: Taub, Technion City, Haifa, Haifa District, Israel

ceClub Seminar - Securing Modern Systems is More Challenging Than Ever (and Requires New and Dedicated Guardrails)
2025-01-29 11:30 - 12:30 | Room: #506, Bldg: Zisapel Building, Technion City, Haifa, Haifa District, Israel
Securing Modern Systems is More Challenging Than Ever (and Requires New and Dedicated Guardrails).
Abstract. Over the past decade, an increasing number of systems and devices have gained Internet connectivity and been enhanced with sensing capabilities and AI. While these advancements have created a world of smarter, more automated, and highly connected devices, they have also introduced significant security and privacy challenges that cannot be effectively addressed with traditional countermeasures.
In the first part of this talk, we will explore the security and privacy concerns of cyber-physical systems. Specifically, we will examine new threats that have emerged with the deployment of technologies like drones and Teslas in real-world environments. Our discussion will highlight methods for detecting intrusive drone filming and securing Teslas against time-domain adversarial attacks.
The second part of the talk focuses on the challenges posed by the coexistence of functional devices with limited computational power (that do not adhere to Moore’s law) alongside sensors with ever-increasing sampling rates. We will explore how threats such as cryptanalysis and speech eavesdropping—previously accessible only to well-resourced adversaries—can now be executed by ordinary attackers using readily available hardware like photodiodes and video cameras. These attacks leverage optical traces or video footage from a device’s power LED to extract sensitive information.
Finally, in the last part of the talk, we will address the emerging need to secure GenAI-powered applications against a new category of threats we call Promptware. This threat highlights the evolving landscape of vulnerabilities introduced by generative AI systems.
Speaker(s): Dr. Ben Nassi
Room: #506, Bldg: Zisapel Building, Technion City, Haifa, Haifa District, Israel

ceClub Seminar - Workloads, Storage, and Service Allocation in Edge Computing
2025-02-05 11:30 - 12:30 | Room: #8, Bldg: CS Taub Building, Technion City, Haifa, Haifa District, Israel, 3200003
Workloads, Storage, and Service Allocation in Edge Computing
Abstract. Edge computing extends cloud capabilities to the proximity of end-users, offering ultra-low latency, which is essential for real-time applications. Unlike traditional cloud systems that suffer from latency and reliability constraints due to distant datacenters, edge computing employs a distributed model, leveraging local edge datacenters to process and store data.
This talk explores key challenges in edge computing across three domains: workloads, storage, and service allocation.
The first part focuses on the absence of comprehensive edge workload datasets. Current datasets do not accurately reflect the unique attributes of edge systems. To address this, we propose a workload composition methodology and introduce WoW-IO, an open-source trace generator. The second part examines aspects of edge storage. Edge datacenters are significantly smaller than their cloud counterparts and require dedicated solutions. We analyze the applicability of a promising mathematical model for edge storage systems and raise inherent gaps between theory and practice. The final part addresses the virtual network embedding problem (VNEP). In VNEP, given a set of requests for deploying virtualized applications, the edge provider has to deploy a maximum number of them to the underlying physical network, subject to capacity constraints. We propose novel solutions, including a proactive service allocation strategy for mobile users, a flexible algorithm for service allocation that is adaptable to the underlying physical topology, and an algorithm for scalable online service allocation.
Speaker(s): Oleg Kolosov
Room: #8, Bldg: CS Taub Building, Technion City, Haifa, Haifa District, Israel, 3200003

Special Seminar: Maximising the capacity of optical networks - how far have come and what else can we do?
2025-02-09 11:00 - 12:30 | Room: Lecture Hall 001, Bldg: Broadcom Semiconductors, Tel Aviv University, Dr. George Wise St. 17, Tel Aviv, Tel Aviv District, Israel, 69978
Optical fibre networks underpin the global communications infrastructure, carrying >95% of all digital data. These optical networks operate on different time- and distance-scales – spanning long-distances (trans-oceanic, inter-satellite) and inter-city, as well as interconnecting servers and GPUs within data centres. The challenge for next-generation networks is in making them intelligent and adaptable to changes in demand and applications in the future.
Advancing AI and scientific research requires optimizing optical networks from the component through to the physical network layer. The physical topology and nonlinear properties of the optical fibre form a key bottleneck affecting achievable throughput in these networks. Optimising the throughput involves solving two NP-hard combinatorial optimisation problems: (i) the physical topology design problem and (ii) the routing and wavelength assignment problem by including the physical properties in ultrawideband optical network design – through and for artificial intelligence.
This talk will consider both of these challenges and their influence the maximum achievable throughput – a vital objective for the future scaling of AI algorithms.
References:
R. Matzner, A. Ahuja, R. Sadeghi, M. Doherty, S. J. Savory, and P. Bayvel, ‘Topology Bench: Systematic Graph Based Benchmarking for Core Optical Networks’, arXiv preprint arXiv:submit/5982227 (2024).
R. Matzner, D. Semrau, R. Luo, G. Zervas, and P. Bayvel, ‘Making intelligent topology design choices: understanding structural and physical property performance implications in optical networks ’, Journal of Optical Communications and Networking, vol. 13, no. 8, p. D53, Aug. 2021.
R. Matzner, R. Luo, G. Zervas, and P. Bayvel, ‘Expanding Graph Neural Networks for Ultra-Fast Optical Core Network Throughput Prediction to Large Node Scales’, in European Conference on Optical Communication (ECOC 2022), paper We5.61, Optica Publishing Group, Sep. 2022, p. We5.61.
R. Matzner, R. Luo, G. Zervas, and P. Bayvel, ‘Ultra-fast Optical Network Throughput Prediction using Graph Neural Networks’, in 26th International Conference on Optical Network Design and Modelling, May 2022, p. 3.
R. Matzner, R. Luo, G. Zervas, and P. Bayvel, ‘Intelligent performance inference: A graph neural network approach to modelling maximum achievable throughput in optical networks’, APL Machine Learning, vol. 1, no. 2, p. 026112, May 2023.
Distinguished Speaker: Prof. Polina Bayvel
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Professor Polina Bayvel is the Head of the (https://www.ee.ucl.ac.uk/ong/) (Department of Electronic & Electrical Engineering), UCL, a research group she set up in 1994. Her research interests are in the area of optical communications and networks on different time- and length scales (from trans-oceanic distances to intra- and inter-data centre communications and routing. This includes the analysis and implementation of intelligent optical networks, wavelength routing, high-speed optical transmission, and the study and mitigation of optical fibre nonlinearities. Following her PhD, she worked as a systems engineer in the STC Submarine Systems, Greenwich (now Alcatel Submarine Networks) on the first amplified optical transmission and in Nortel (Harlow Labs) on optical network planning.
In 1994 she received a Royal Society University Research fellowship and moved to UCL to set up ONG, the first academic systems engineering group in optical networks.
She is a Fellow of the Royal Society, Royal Academy of Engineering, IEEE and Optica. She is the 2021 recipient (and first woman) of the Thomas Young Medal of the UK Institute of Physics and the first woman to be awarded the 2023 Royal Society Rumford Medal since it was introduced in 1800! In 2024 she received the Humboldt Foundation Research Prize.
Author/co-author of more than 500 refereed journal and conference papers, she has led the UK EPSRC Programme Grant (https://www.unloc.net/) (2012-2018), focused on unlocking – and maximising – the capacity of optical fibre communications and currently leads the EPSRC Programme Grant TRANSNET (2018-2026): https://transnet.org.uk/ focused on transforming optical networks for the cloud.
Agenda:
11:00 – 11:30 התכנסות וכיבוד קל
11:30 – 12:30 הרצאה של פרופ' פולינה בייבל
Room: Lecture Hall 001, Bldg: Broadcom Semiconductors, Tel Aviv University, Dr. George Wise St. 17, Tel Aviv, Tel Aviv District, Israel, 69978

Workshop on Renewable Energy: Importance and Future
2025-04-22 12:30 - 14:00 | NABLUS , West Bank, Palestine
ستتناول هذه الورشة أهمية الطاقة المتجددة ودورها في التنمية المستدامة والتطورات المستقبلية. سيقدم الدكتور تامر الخطيب رؤىً حول حلول الطاقة المبتكرة والشبكات الذكية. ويتماشى هذا الحدث مع شعار يوم الطاقة النظيفة من خلال تعزيز الطاقة النظيفة والاستدامة.
Speaker(s): AL KHATEEB,
NABLUS , West Bank, Palestine

Sustainability in Energy Systems
2025-04-23 12:30 - 14:00 | NABLUS , West Bank, Palestine
ستستكشف هذه الورشة مبادئ الاستدامة في أنظمة الطاقة ، مع التركيز على الاستخدام الفعال للموارد، وتكامل مصادر الطاقة المتجددة، وحلول الطاقة الخضراء . سيقدم الدكتور شادي صويلحة رؤىً حول أحدث التقنيات المستدامة ودورها في تشكيل مستقبل الطاقة. تتماشى هذه الجلسة مع شعار يوم IEEE PES: "طاقة نظيفة، شبكات أذكى، وحياة أفضل".
Speaker(s): Swailha,
NABLUS , West Bank, Palestine

Bendable Computing
2025-05-08 17:00 - 18:00 | Virtual: https://events.vtools.ieee.org/m/480935
RE: Monthly webinar – Bendable Computing
Speaker: Dr. Emre Ozer, Senior Director of Processor Development, Pragmatic
Date: Thursday, May 8th, 2025 5:00 PM (Israel Time).
Dear IEEE Israel chapter members, Dear guests,
The IEEE Computer Society Israel conducts a series of webinars in different areas of computer systems, Software engineering, Computer architectures, data center, accelerators for machine learning, security, and more. The webinars offer insightful and enriching talks held by international leaders and professionals of the computer society sector.
The next free online webinar will include a special talk “Bendable Computing” by Dr. Emre Ozer, Senior Director of Processor Development, Pragmatic.
his talk will introduce Pragmatic Semiconductor’s FlexIC technology, and present how it allows us to develop "bendable" processors to enable emerging applications at Extreme Edge.
The Webinar is free, but pre-registration is required. So, please sign up using this (https://technion.zoom.us/meeting/register/xGDbeS8-RZaIw_OzP9ylaw) and the Zoom session details will be provided after registration.
Please contact us for any further details and updates on the series of IEEE Computer Society Webinars.We are looking forward to your participation and future collaboration.
Prof. Avi Mendelson Prof. Freddy Gabbay
Avi.mendelson@technion.ac.il freddy.gabbay@mail.huji.ac.il
Chairman Vice-Chair
Speaker(s): , Emre
Virtual: https://events.vtools.ieee.org/m/480935

IEEE Israel - 2025 General Assembly, 13.5.2025
2025-05-13 17:00 - 18:30 | Virtual: https://events.vtools.ieee.org/m/480726
חבר/ה- IEEE ISRAEL יקר/ה
אני מתכבד להזמין אותך לאספה הכללית לשנת 2025 של הארגון, אשר תתקיים באופן מקוון באמצעות ZOOM ביום שלישי, 13.5.2025.
האספה תפתח להצטרפות החל משעה 16:30, ותתקיים בכל מספר נוכחים החל משעה 17:00.
האספה הכללית היא המוסד העליון של העמותה והיא מתכנסת לפחות אחת לשנה. האספה תדון בנושאים שעל סדר היום.
ניתן להוסיף נושאים לסדר היום במהלך האספה ובלבד שהוחלט על כך בהצבעה.
חבר הרשום כפעיל ב- IEEE ביום האספה בשנת 2025 ואשר נוכח בהצבעה זכאי להצביע.
הנך מתבקש.ת להירשם ולמלא את פרטיך באמצעות הקישור: https://aeai-org-il.zoom.us/webinar/register/WN_tDbJY6o8R0K9d7D_nm-prA
לאחר שתסיים.י את הליך הרישום, המערכת תשלח אליך באופן אוטומטי במייל (לכתובת הדוא"ל שרשמת) את הזימון (קישור) לפגישה.
יש לעשות שימוש בקישור זה להתחברות ביום האספה.
בברכה,
שמואל אוסטר
יו"ר IEEE סניף ישראל
Chair, IEEE Israel Section
Agenda:
על סדר היום:
· בחירת יו"ר ומזכיר לאספה כללית זו
· דו"ח יו"ר הסניף, שמואל אוסטר
· דו"ח כספי לשנת 2024 – שמואל אוסטר ורואה החשבון גיל משיח
· דו"ח ועדת ביקורת על הדו"חות הכספיים: רפי הוידה ואיתי דברן
· אישור דו"חות כספיים לשנת 2024 ותקציב ל- 2025.
· אישור מינוי רו"ח וחברי וועדת הביקורת.
· נושאים שונים שיועלו ע"י הנוכחים.
Virtual: https://events.vtools.ieee.org/m/480726

Radar or Lidar What to Choose for Automotive Applications
2025-05-15 11:00 - 12:00 | Room: 11, Bldg: Kitot Handasa, Tel Aviv University, Tel Aviv, Central District, Israel
This lecture addresses one of the hottest technological debates in the modern automobile industry: selecting radar or LiDAR technologies for autonomous and active safety-equipped vehicles. The lecture presents a structured comparison of the two technologies, focusing on their distinct operational characteristics, advantages, and limitations. Radar and LiDAR operate at different frequency bands, which leads to significant differences in how they interact with the environment. Radar is favored for its robustness in adverse weather and low-light conditions, providing long-range detection at a relatively low cost. It also allows for flexible integration behind nontransparent vehicle fascia, making it highly adaptable for commercial vehicle use. On the other hand, LiDAR offers superior angular resolution and spatiotemporal consistency, which are critical for tasks such as object recognition and mapping in autonomous driving.
This lecture begins by outlining the core functionalities of radar and lidar systems and exploring how their unique physical properties, such as wavelength and propagation behaviors, influence their performance in various driving scenarios. Key factors such as range, accuracy, detection reliability, and operational costs will be evaluated, along with a detailed analysis of signal processing techniques used by each sensor type. Additionally, the limitations of LiDAR, including its higher cost and sensitivity to environmental factors, will be contrasted with radar's challenges, such as interference and resolution constraints.
By highlighting recent advancements in both technologies, including digital radars with high-resolution imaging capabilities and efforts to reduce the cost of long-range LiDAR, this lecture aims to provide a comprehensive understanding of the trade-offs involved in choosing between radar and LiDAR for different automotive applications. Future research directions, such as the integration of multi-sensor systems and potential cross-modality innovations, will also be discussed to inspire further developments in autonomous vehicle sensing technologies.
Speaker(s): , Igal Bilik
Agenda:
11:00-11:50 Lecture
11:50-12:00 QNA
Room: 11, Bldg: Kitot Handasa, Tel Aviv University, Tel Aviv, Central District, Israel
