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BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20230504T090000
DTEND;TZID=Asia/Jerusalem:20230504T172000
DTSTAMP:20260404T040256
CREATED:20230427T134113Z
LAST-MODIFIED:20230503T154320Z
UID:1987-1683190800-1683220800@ieee.org.il
SUMMARY:The 11th IEEE Israel and Tel Aviv University Antenna Symposium
DESCRIPTION:09:00-09:30 Registration & Coffee\n09:30-09:40 Welcome and Opening Remarks\, Amir Boag\, Yarden Mazor\n09:40-10:40 Andrea Massa\, A. Benoni\, P. Da Rù\, G. Oliveri\, L. Poli\, P. Rocca\, M. Salucci\, F. Zardi – University of Trento\, Italy\nKeynote: The "Smart EM Environment" Paradigm as Enabler of Next Generation Wireless Systems – An Overview from the Device-Scale to the System Planning\n10:40-11:00 Lior Maman and Amir Boag – Tel Aviv University\, Phase-Only Beam Shaping for Transmitting Array Antennas in Radar Applications\n11:00-11:30 Coffee Break\n11:30-11:50 Lea Beilkin-Sirota – Tel Aviv University\, Tunneling-like dynamics in non-Hermitian networks\n11:50-12:10 Yarden Mazor – Tel Aviv University\, Using Temporal Modulation to Enhance DoA Sensitivity\n12:10-12:30 Amit Shaham and Ariel Epstein – Technion\nAll-angular Transparency via the Generalized Huygens’ Condition: Tailored Nonlocality from Meta-atoms to Metasurfaces\n12:30-13:30 Lunch on site\n13:30–14:30 Zhongxiang Shen – Nanyang Technological University\, Singapore\, Keynote: Design of Compact and Wide-Band Antennas\n14:30-14:50 Amir Shlivinski – Ben-Gurion University\, Yakir Hadad – Tel Aviv University\, Temporal Discontinuities in Waveguides\n14:50-15:10 D. Vovchuk\, K. Grotov\, M. Khobzei\, V. Tkach\, A. Mikhailovskaya\, D. Kolchanov\, D. Dobrykh\, A. Machnev\, V. Kozlov\, and Pavel Ginzburg – Tel Aviv University\, Genetically Designed Superscatterers for Radar Deception and Beckoning\n15:10–15:40 Coffee Break & Refreshments\n15:40-16:00 Ehud Heyman – Tel Aviv University\, On Local Pulsed Beam Solutions of the Time-Dependent Wave Equation: Scattering\, Diffraction\, and Propagation in Non-Homogeneous Medium\n16:00-16:20 Yaniv Brick – Ben-Gurion University\, Fast and Robust Low Rank Compression of Impedance Matrix Blocks\n16:20-16:40 Roee Geva and Raphael Kastner – Tel Aviv University\, Symmetries and Non-Reflectivity in Electromagnetics\n16:40-17:00 Vladimir Vulfin – Electromagnetics Infinity\, Reuven Shavit – Ben-Gurion University\, Surface Impedance Extraction of a Cylindrical Metasurface Structure\n17:00 – Wine and Cheese Reception\nRoom: Rosenblatt Auditorium\, Bldg: Software Engineering Building\, Tel Aviv University\, Faculty of Engineering\, Tel Aviv\, Tel Aviv District\, Israel
URL:https://ieee.org.il/event/the-11th-ieee-israel-and-tel-aviv-university-antenna-symposium/
LOCATION:Room: Rosenblatt Auditorium\, Bldg: Software Engineering Building\, Tel Aviv University\, Faculty of Engineering\, Tel Aviv\, Tel Aviv District\, Israel
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20230511T163000
DTEND;TZID=Asia/Jerusalem:20230511T183000
DTSTAMP:20260404T040256
CREATED:20230322T123825Z
LAST-MODIFIED:20230510T172504Z
UID:1941-1683822600-1683829800@ieee.org.il
SUMMARY:IEEE Israel - 2023 General Assembly\, 11.5.2023
DESCRIPTION:חבר/ת IEEE  ישראל יקר/ה\,\nאני מתכבד להזמין אותך ביום חמישי בתאריך ה- 11.5.2023 לאסיפה הכללית לשנת 2023 של הארגון\, אשר תתקיים באופן היברידי\, בזום או במפגש פיזי בלשכת המהנדסים\, בית המהנדס\, רחוב דיזינגוף 200 – לבחירתך.\nהאסיפה תפתח להצטרפות החל משעה 16:30\, ותתקיים בכל מספר נוכחים החל משעה 17:00.\nהאסיפה הכללית היא המוסד העליון של העמותה והיא מתכנסת לפחות אחת לשנה. האסיפה תדון בנושאים שעל סדר היום. ניתן להוסיף נושאים לסדר היום במהלך האסיפה ובלבד שהוחלט על כך בהצבעה.\nחבר הרשום כפעיל ב IEEE ביום האספה בשנת 2023 ואשר נוכח בהצבעה זכאי להצביע.\nעל סדר היום:\n· בחירת יו"ר ומזכיר לאסיפה כללית זו\n· דו"ח היו"ר שמואל אוסטר\n·  זרקור על פעילות של 2 צ'אפטרים בישראל.\n· דו"ח כספי לשנת 2022 – שמואל אוסטר ורואה החשבון גיל משיח\n· דו"ח ועדת ביקורת על הדו"חות הכספיים: רפי הוידה ואיתי דברן\n· אישור דו"חות כספיים לשנת 2022 ותקציב ל- 2023.\n· אישור מינוי רו"ח וחברי וועדת הביקורת.\n· נושאים שונים שיועלו ע"י הנוכחים.\nמאחר והאספה מתקיימת באופן היברידי הנך מתבקש.ת להרשם ולמלא את פרטיך בין אם תצטרף.י בזום או לחילופין באם תגיע לאספה באופן פיזי- לצורך הערכות\, אנא ציין.י בזמן ההרשמה האם תשתתף בזום או שתגיע.י למשרדי לשכת המהנדסים. הקישור להרשמה:\nhttps://aeai-org-il.zoom.us/meeting/register/tZMrdu6qqTkoGdbmFYXAhRiG_rYMXD6mL56M\nלאחר שתסיים.י את הליך הרישום\, המערכת תשלח אליך באופן אוטומטי במייל (לכתובת הדוא"ל שרשמת) את הזימון (קישור) לפגישה. במידה והנך משתתף.ת בזום יש לעשות שימוש בקישור זה להתחברות ביום האסיפה.\nבברכה\,\nשמואל אוסטר\nChair – IEEE Israel Section\nהקישור להרשמה:\nhttps://aeai-org-il.zoom.us/meeting/register/tZMrdu6qqTkoGdbmFYXAhRiG_rYMXD6mL56M\nאם הקישור משתבש\, יש להעתיק את הכתובת לבראוזר\, וזה עובד.\nBldg: לשכת המהנדסים\, בית המהנדס\, 200 Dizengoff Street\, Tel Aviv\, Tel Aviv District\, Israel\, Virtual: https://events.vtools.ieee.org/m/353636
URL:https://ieee.org.il/event/ieee-israel-2023-general-assembly-11-5-2023/
LOCATION:Bldg: לשכת המהנדסים\, בית המהנדס\, 200 Dizengoff Street\, Tel Aviv\, Tel Aviv District\, Israel\, Virtual: https://events.vtools.ieee.org/m/353636
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20230615T090000
DTEND;TZID=Asia/Jerusalem:20230615T171500
DTSTAMP:20260404T040256
CREATED:20230523T080804Z
LAST-MODIFIED:20230614T173843Z
UID:2021-1686819600-1686849300@ieee.org.il
SUMMARY:The 11th IEEE Israel AP/MTT and Tel Aviv University Underwater Acoustics Symposium
DESCRIPTION:Dear Colleagues\,\nYou are cordially invited to attend The 11th IEEE Israel AP/MTT Chapter and Tel Aviv University Underwater Acoustics Symposium\, Thursday 15 June\, 2023.\nA preliminary program of the conference is attached.\nParticipation is free of charge\, but advance registration at http://web.eng.tau.ac.il/boag/conf2/ is required.\nThe same link is embedded in the program.\nPlease spread this message.\nBest regards\,\nAmir Boag and Or Lasri\n===============================================================\nProf. Amir Boag\nDepartment of Physical Electronics\, School of Electrical Engineering\nFaculty of Engineering\, Tel-Aviv University\nTel-Aviv 69978\, Israel\nPhone: (tel:%2B972-3-6408246) E-mail: boag@tau.ac.il\nCellular: (tel:%2B972-50-9422426)\nFax: (tel:%2B972-3-6423508) URL: http://www.eng.tau.ac.il/~boag/\nAgenda:\n09:00-09:30 Registration & Coffee\n09:30-09:40 Welcome and Opening Remarks\nProf. Noam Eliaz – Dean of the Faculty of Engineering\, Prof. Amir Boag – TAU Underwater Acoustics Center\n09:40-10:40 Capt. Ioannis Androulakis – MANiBUS Ltd.\, Greece\nThe Underwater Aspects of Maritime Security – Underwater Acoustics: Technologies and\nApplications\n10:40-11:00 Prof. Ehud Heyman – Tel Aviv University\nThe Spectral Theory of Transient (STT): New Directions and Canonical Integrals\n11:00-11:30 Coffee Break\n11:30-11:50 Iris Roger-Eitan and Dr. Anna Gleizer – Rafael\nNear Field to Far Field – Numerical and Physical Methods\n11:20-12:10 Dr. Evgeny Chernokozhin and Prof. Amir Boag – Tel Aviv University\nEvolution of Solvers for Acoustic Scattering by Thin Elastic Shells\n12:10-12:30 Dr. Lea Beilkin-Sirota – Tel Aviv University\nActive Acoustic Imitation of a Rigid Object under Varying Detection Frequency\n12:30-12:50 Prof. Boris Katsnelson – Haifa University\nLandau-Zener Mechanism of the Waveguide Mode Coupling and its Manifestation in Shallow Water Sound\nPropagation\n12:50-13:50 Lunch on site (Dairy)\n13:50-14:10 Azriel Sinai and Yaron Doweck – Rafael\, Yair Mazal – Ben Gurion University\nReal Time Control\, Telemetry and Image Streaming from and to Autonomous Underwater Vehicles\n14:10-14:30 Prof. Roee Diamant – Haifa University\, Prof. Paolo Casari University of Trento\, Italy &\nProf. Stefano Tomasin – University of Padova\, Italy\nSecret Key Generation from Route Propagation Delays for Underwater Acoustic Networks\n14:30-14:50 Prof. Izhak Bucher\, Maya Friedlander\, and Ernst Uscinski – Technion\nLeveraging Ultrasonic Parametric Acoustic Arrays to Manipulate External Low-Frequency Sounds\n14:50-15:10 Nadav Arbel\, Prof. Moshe Tur\, and Prof. Avishay Eyal – Tel Aviv University\nQuasi-distributed Ultrasound Sensing via an Array of Fiber Bragg Gratings\n15:10–15:40 Coffee Break & Refreshments\n15:40-16:00 Prof. Joseph Tabrikian – Ben-Gurion University\nOptimal Model Order Selection in Normal Modes Model Using Misspecified Cramer-Rao Bound\n16:00-17:00 Dr. Gil Averbuch – Woods Hole Oceanographic Institution\, USA\nNew England Shelf Break and Seamount Acoustics\n17:00 – Wine and Cheese Reception\nRoom: Rosenblatt Auditorium\, Bldg: Software Engineering building\, Tel Aviv University\, Tel Aviv\, Tel Aviv District\, Israel
URL:https://ieee.org.il/event/the-11th-ieee-israel-ap-mtt-and-tel-aviv-university-underwater-acoustics-symposium/
LOCATION:Room: Rosenblatt Auditorium\, Bldg: Software Engineering building\, Tel Aviv University\, Tel Aviv\, Tel Aviv District\, Israel
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20230620T090000
DTEND;TZID=Asia/Jerusalem:20230620T170000
DTSTAMP:20260404T040256
CREATED:20230121T100923Z
LAST-MODIFIED:20230619T205723Z
UID:1856-1687251600-1687280400@ieee.org.il
SUMMARY:SeaAI Artificial Intelligence and Sea
DESCRIPTION:The 10th edition of the Haifa conference on marine sciences will take place (in-person) on 20th of June 2023 with the theme of:\nSeaAI: Artificial Intelligence and Sea. SeaAI is intended to provide a forum for research scientists\, engineers\, and practitioners\nthroughout the world to present their research findings\, ideas\, and applications in the areas of Artificial Intelligence and Sea.\nSeaAI will include keynote speeches and invited presentations by renowned scientists and engineers.\nConference topics include:\nArtificial Intelligence in Ocean Science and Technology\nEmerging Sensor Technologies for Sea Applications\nSensor Data Processing and AI\nIntelligent Robotic Systems\nRobot sensors\, vision and perception\nMarine sensing and robotics\nMarine Biology and AI\nUnderwater acoustics and sonar with AI\nMarine environment\, oceanography\, and meteorology\nBlue economy and AI\nApplied Data Science and Engineering\nDeep Learning\nReinforcement Learning\nTransfer Learning\nComputer Vision\nGraph Mining\nBig Data Analysis\nStatistical Learning\nData Visualization\nEducation\, Sea\, and Data Science\nData Integration\nUniversity of Haifa\, Haifa\, Haifa District\, Israel
URL:https://ieee.org.il/event/seaai-artificial-intelligence-and-sea/
LOCATION:University of Haifa\, Haifa\, Haifa District\, Israel
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20231106T090000
DTEND;TZID=Asia/Jerusalem:20231108T170000
DTSTAMP:20260404T040256
CREATED:20230319T113557Z
LAST-MODIFIED:20231105T090925Z
UID:1936-1699261200-1699462800@ieee.org.il
SUMMARY:IEEE COMCAS 2023 - May 6\, 2023 - Summary / Paper submission deadline (Updated!)
DESCRIPTION:On behalf of the IEEE COMCAS 2023 Steering Committee\, it is our pleasure to launch the 9th International IEEE Conference on Microwaves\, Communications\, Antennas\, Biomedical Engineering and Electronic Systems (IEEE COMCAS 2023).\nIn 2023 the international IEEE COMCAS will continue to evolve and provide an advanced multidisciplinary forum for the exchange of ideas\, research results\, and industry experience in a range of key areas i.e.\, microwaves\, communications and sensors\, antennas\, biomedical engineering\, RF and microwave devices and circuits\, thermal management and electronic packaging\, signal processing and imaging\, as well as radar\, acoustics and microwave system engineering.\nIn its entirety the event includes a technical program\, industry exhibits\, and guest presentations from global experts on recent academic and industry advancements.\nIn launching the 2023 event\, we would also like to welcome you to the sunshine of the eastern Mediterranean\, in Tel Aviv. As a cosmopolitan city of stunning views and endless innovation Tel Aviv is a center that resonates with an energized atmosphere\, streets of storied history\, and an internationally recognized nightlife.\nTaking place 6-8 November 2023 in Tel Aviv\, Israel\, at the David Intercontinental Hotel by the Mediterranean Sea; IEEE COMCAS will continue a biennial series tailored to maximize professional networking\, support the candid exchange of ideas\, and develop a range of enduring opportunities.\nConference Dates: 6-8 November 2023\nVenue: David Intercontinental Hotel\, Tel Aviv\, Israel\nImportant Dates:\n– May 6\, 2023 – Proposals deadline for workshops\, short courses and tutorials\n– Updated: May 6\, 2023 – Summary / Paper submission deadline\n– Updated: July 14\, 2023 – Notification of Acceptance\n– September 4\, 2023 – Speaker's Registration deadline\n– September 4\, 2023 – Final manuscript submission\nDownload Call for Papers file (https://www.comcas.org/Portals/173/CFP-03-12-2023.pdf)\nPapers submission: (https://edas.info/N30559)\nLIST OF TOPICS\nCommunications and Sensors\nBeyond 5G – Systems & Technologies\nAI\, Machine Learning\, Deep Learning in Communications and Sensors\nBig Data in Communication Networks\nMIMO & Space-Time Coding Technologies\n5G systems & Millimeter Wave Propagation\nCognitive Radio & Spectral Sharing\nCommunications Security\nFirst Responder/Military Communications\nGreen Communication\nInternet of Things\nLong Range Low Power Networks\nMicro/Pico/Femtocell Devices and Systems\nModulation & Signal Processing Technologies\nOn-Body and Short Range Communications\nRadio over Fiber & Optical/Wireless Convergence\nSensor Networks and Technologies\nSoftware-Defined Radio & Multiple Access\nAntennas\, Propagation\, and Scattering\nAntenna Theory and Design\nSmart Antennas\, Beamforming and MIMO\nWave Propagation and Channel Modeling\nWave Scattering and RCS\nNanoEM\, Plasmonics\, and Applications\nMetamaterials\, FSS and EBG\nEM Field Theory and Numerical Techniques\nEM Interference & Compatibility\, SI\nSpectrum Management and Monitoring\nELF\, RF\, μWave\, mmW and THz Measurements\nElectronic Packaging & Thermal Management (P&TM)\nChip\, Package and PCB – Design\, Advanced Materials and Technologies\nChip & Board Level Assembly\nAdvanced Packaging – 2.5D\, 3D and Heterogenous\nIntegration\n3D Printing & Additive Manufacturing of Electronics\nElectro Photonics Packaging\nAdhesives\, Molding & Encapsulation – Materials &\nTechnologies\nSoldering & Brazing for Electronic Packaging\nBio Medical Packaging\nPlating & Coating – Materials & Technologies\nDestructive and Non-destructive Testing\nThermal Management in Electronic Systems – Methods\,\nModeling and Solutions\nConnectors\, Cables & Routing\nInspection – Technologies & Methods\nReliability in Electronic Systems\nBiomedical EngineeringBig Data in Medicine\nArtificial Intelligence\, Machine Learning\, Deep Learning\nBiomedical Systems and Applications\nAdvances in Medical Imaging Technology\nMedical RF\, MW & MMW Applications and Devices\nMedical Image Processing\nAcousto-Optic Technologies\nNovel Therapeutic Modalities\nEffects of RF and MW on Biological Tissues\nRF/MW Devices and Circuits\, RFICs\nSolid-State Devices\, RFICs\nμWave\, mmW and Sub-mmW Circuits/Technologies\nNano and THz Devices/Technologies\nMicrowave Photonics\nPassive Components and Circuits\nFilters and Multiplexers\nFerroelectrics\, RF MEMS\, MOEMS\, and NEMS\nActive Devices and Circuits\nRF Power Amplifiers and Devices\nTunable and Reconfigurable Circuits/Systems\nAnalog/Digital/Mixed RF Circuits\nCircuit Theory\, Modeling and Applications\nInterconnects\, Packaging and MCM\nCAD Techniques for Devices and Circuits\nEmerging Technologies\nInternet of Things Devices\nMicrowave Systems\, Radar\, Acoustics\nAeronautical and Space Applications\nRFID Devices/Systems/Applications\nAutomotive/Transportation Radar & Communications\nEnvironmentally Sensitive (“Green”) Design\nUWB and Multispectral Technologies & Systems\nEmerging System Architectures\nModelling Techniques for RF Systems\nRadar Techniques\, Systems and Applications\nSonar Systems and Applications\nWireless Power Transfer & Energy Harvesting\nTerahertz Systems\nAI\, Machine Learning\, Deep Learning in Microwave\, Radar\, and Acoustic Systems\nSignal Processing (SP) and Imaging\nMicrowave Imaging and Tomography\nAcoustic/Sonar Imaging and Techniques\nRadar SP and Imaging\, SAR\, ATR\nMIMO SP for Radar\nGround and Foliage Penetration Systems\nSignal Acquisition and Sensor Management\nDF\, Emitter Location\, Elint\, Array Processing\nTarget Detection\, Identification and Tracking\nData Fusion\nTime Domain and UWB SP\nAI\, Machine Learning\, Deep Learning in Signal and Image Processing\nConference Chair: Shmuel Auster\nTechnical Program Chair: Amir Boag\nWebsite: www.comcas.org\nCo-sponsored by: IEEE MTTS\, IEEE AESS\, IEEE APS\, IEEE EPS\, EuMA\, AEAI\nDAVID INTERCONTINENTAL HOTEL\, Tel Aviv\, Tel Aviv District\, Israel
URL:https://ieee.org.il/event/ieee-comcas-2023/
LOCATION:DAVID INTERCONTINENTAL HOTEL\, Tel Aviv\, Tel Aviv District\, Israel
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20231207T160000
DTEND;TZID=Asia/Jerusalem:20231207T173000
DTSTAMP:20260404T040256
CREATED:20231128T152735Z
LAST-MODIFIED:20231206T180646Z
UID:2233-1701964800-1701970200@ieee.org.il
SUMMARY:Chiplet approaches to scale up and scale out machine learning computation\, Prof. Zhengya Zhang\, University of Michigan\, Ann Arbor
DESCRIPTION:Abstract\nNeural network (NN) models are rapidly increasing in size and complexity\, surpassing the pace of NN chip upgrades. The development of monolithic chips to match these evolving models is both expensive and challenging. Alternatively\, modular chiplets can be designed and reused to create multi-chip packages (MCPs) capable of addressing diverse NN models and tasks. The future success of chiplet technology hinges on advancements in chiplets that offer high utilization and flexibility\, efficient high-bandwidth die-to-die interfaces\, and high-density packaging. In this presentation\, I will introduce two MCPs resulting from our collaboration with Intel and the Institute of Microelectronics in Singapore. The first MCP\, NetFlex\, integrates four NN chiplets using high-density fan-out wafer level packaging (HD-FOWLP). NetFlex’s flexible chiplet design and lightweight die-to-die interface enable scalability for larger configurations. The second MCP\, Arvon\, utilizes Embedded Multi-die Interconnect Bridge (EMIB) to integrate an FPGA chiplet and two DSP chiplets. Arvon is a programmable MCP that supports various workloads\, including NN and communication signal processing. Its flexibility allows for scalability to accommodate evolving workloads over time.\nBio\nZhengya Zhang received the B.A.Sc. degree from the University of Waterloo in 2003\, and the M.S. and Ph.D. degrees from UC Berkeley in 2005 and 2009\, respectively. Since 2009\, he has been with the Department of Electrical Engineering and Computer Science at the University of Michigan\, Ann Arbor\, where he is currently a full professor. His research primarily focuses on low-power and high-performance VLSI circuits and systems\, with applications in computing\, communications\, and signal processing. Dr. Zhang was a recipient of the NSF CAREER Award\, the Intel Early Career Faculty Award\, the University of Michigan Neil Van Eenam Memorial Award\, and the David J. Sakrison Memorial Prize from UC Berkeley. He serves as an IEEE Solid-State Circuits Society Distinguished Lecturer.\nVirtual: https://events.vtools.ieee.org/m/387202
URL:https://ieee.org.il/event/chiplet-approaches-to-scale-up-and-scale-out-machine-learning-computation-prof-zhengya-zhang-university-of-michigan-ann-arbor/
LOCATION:Virtual: https://events.vtools.ieee.org/m/387202
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20240306T090000
DTEND;TZID=Asia/Jerusalem:20240306T110000
DTSTAMP:20260404T040256
CREATED:20240227T220034Z
LAST-MODIFIED:20240305T233414Z
UID:2336-1709715600-1709722800@ieee.org.il
SUMMARY:On-chip Engineering
DESCRIPTION:A system-on-a-chip or system-on-chip is an integrated circuit that integrates most or all components of a computer or other electronic system. During the lecture\, the system on chip will be overviewed followed by the experimental demonstrations.\nCo-sponsored by: Prof Alina Karabchevsky\nEshel\, Southern District\, Israel
URL:https://ieee.org.il/event/on-chip-engineering/
LOCATION:Eshel\, Southern District\, Israel
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20240319T163000
DTEND;TZID=Asia/Jerusalem:20240319T180000
DTSTAMP:20260404T040256
CREATED:20240228T221527Z
LAST-MODIFIED:20240319T110818Z
UID:2339-1710865800-1710871200@ieee.org.il
SUMMARY:Accelerating Time to Tapeout - 6 reasons to utilize the cloud
DESCRIPTION:In recent years EDA is shifting more and more to the AWS cloud to accelerate time to tapeout\, with companies like Arm\, NXP and Marvell openly speaking about their cloud adoption journey. In this session we cover the 6 reasons companies are moving EDA to AWS\, as well as the the latest announcements made by EDA tool providers to enable customers to do more with the same engineering staff in the cloud.\nSpeaker(s): Ronen Laviv\,\nVirtual: https://events.vtools.ieee.org/m/409166
URL:https://ieee.org.il/event/accelerating-time-to-tapeout-6-reasons-to-utilize-the-cloud/
LOCATION:Virtual: https://events.vtools.ieee.org/m/409166
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20240411T083000
DTEND;TZID=Asia/Jerusalem:20240411T160000
DTSTAMP:20260404T040256
CREATED:20240326T123019Z
LAST-MODIFIED:20240410T150419Z
UID:2368-1712824200-1712851200@ieee.org.il
SUMMARY:Full day Seminar on electro-mechanical connectors
DESCRIPTION:הסניף הישראלי של  IEEE Electronic Packaging Society וענף זיווד אלקטרוני ומיקרואלקטרוני בלשכת המהנדסים והאדריכלים\,\nמזמינים אתכם/ן לקחת חלק ביום עיון שיעסוק במחברים אלקטרו-מכאניים.\nיום חמישי |11.4.2024| 08:30-16:00| מכון מופ"ת\, שושנה פרסיץ 13\, תל-אביב\nמהנדסי והנדסאי מכונות וחשמל אינם לומדים על מחברים אלקטרו-מכאניים במסגרת הלימודים. בפועל רבים מהעוסקים בתכנון אלקטרו-מכני נדרשים לאפיין ולתכנן את סוגי המחברים שישבו על הלוח\, יחוברו לצמות\, ימוקמו בתוך הקופסא או מחוץ לקופסא.\nהצטרפו אלינו ליום עיון שבו תוכלו ללמוד ולשמוע ביום מרוכז אחד מגוון תכנים חשובים ושימושיים\, הקשורים לעולם המחברים האלקטרו-מכאניים.\nמידע חשוב מפי מומחים*\n* הזדמנות למפגש עם קולגות מהתחום*\n* ארוחת צהרים קלה*\nמכון מופ"ת\, שושנה פרסיץ 13\, תל-אביב\, Tel Aviv\, Tel Aviv District\, Israel
URL:https://ieee.org.il/event/full-day-seminar-on-electro-mechanical-connectors/
LOCATION:מכון מופ"ת\, שושנה פרסיץ 13\, תל-אביב\, Tel Aviv\, Tel Aviv District\, Israel
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20240507T163000
DTEND;TZID=Asia/Jerusalem:20240507T181500
DTSTAMP:20260404T040256
CREATED:20240405T143022Z
LAST-MODIFIED:20240506T185403Z
UID:2382-1715099400-1715105700@ieee.org.il
SUMMARY:IEEE Israel - 2024 General Assembly\, 7.5.2024
DESCRIPTION:חבר/ת IEEE  ישראל יקר/ה\,\nאני מתכבד להזמין אותך לאסיפה הכללית לשנת 2024 של הארגון\, אשר תתקיים באופן מקוון באמצעות ZOOM ביום שלישי\, 7.5.2024.\nהאסיפה תפתח להצטרפות החל משעה 16:30\, ותתקיים בכל מספר נוכחים החל משעה 17:00.\nהאסיפה הכללית היא המוסד העליון של העמותה והיא מתכנסת לפחות אחת לשנה. האספה תדון בנושאים שעל סדר היום.\nניתן להוסיף נושאים לסדר היום במהלך האספה ובלבד שהוחלט על כך בהצבעה.\nחבר הרשום כפעיל ב- IEEE ביום האסיפה בשנת 2024 ואשר נוכח בהצבעה זכאי להצביע.\nעל סדר היום:\n· בחירת יו"ר ומזכיר לאסיפה כללית זו\n· דו"ח היו"ר שמואל אוסטר\n·  דו"ח כספי לשנת 2023 – שמואל אוסטר ורואה החשבון גיל משיח\n· דו"ח ועדת ביקורת על הדו"חות הכספיים: רפי הוידה ואיתי דברן\n· אישור דו"חות כספיים לשנת 2023 ותקציב ל- 2024.\n· אישור מינוי רו"ח וחברי ועדת הביקורת.\n· נושאים שונים שיועלו ע"י הנוכחים.\nהנך מתבקש.ת להירשם ולמלא את פרטיך באמצעות הקישור:\nhttps://aeai-org-il.zoom.us/webinar/register/WN_FNbhE8q-RvaD_Vfiw5eHIQ\nלאחר שתסיים.י את הליך הרישום\, המערכת תשלח אליך באופן אוטומטי במייל (לכתובת הדוא"ל שרשמת) את הזימון (קישור) לפגישה.\nיש לעשות שימוש בקישור זה להתחברות ביום האספה.\nבברכה\,\nשמואל אוסטר\nיו"ר IEEE סניף ישראל\nChair\, IEEE Israel Section\nהקישור להרשמה:\nhttps://aeai-org-il.zoom.us/webinar/register/WN_FNbhE8q-RvaD_Vfiw5eHIQ\nאם הקישור משתבש\, יש להעתיק את הכתובת לבראוזר\, וזה עובד.\nVirtual: https://events.vtools.ieee.org/m/416156
URL:https://ieee.org.il/event/ieee-israel-2024-general-assembly-7-5-2024/
LOCATION:Virtual: https://events.vtools.ieee.org/m/416156
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20240508T170000
DTEND;TZID=Asia/Jerusalem:20240508T183000
DTSTAMP:20260404T040256
CREATED:20240502T180022Z
LAST-MODIFIED:20240507T191015Z
UID:2418-1715187600-1715193000@ieee.org.il
SUMMARY:100-300 GHz Wireless: transistors\, ICs\, systems - Prof. Mark Rodwell\, University of California\, Santa Barbara
DESCRIPTION:Biography\nMark Rodwell holds the Doluca Family Endowed Chair in Electrical and Computer Engineering at UCSB and directs the SRC/DARPA Center for Converged TeraHertz Communications and Sensing. His research group develops nm and THz transistors\, and high-frequency integrated circuits and systems. Prof. Rodwell received the 2010 IEEE Sarnoff Award\, the 2012 Marconi Prize Paper Award\, the 1997 IEEE Microwave Prize\, the 2009 IEEE IPRM Conference Award\, and the 1998 European Microwave Conference Microwave Prize.\nAbstract\nWe describe the opportunities\, and the research challenges\, presented in the development of 100-300GHz wireless communications and imaging systems. In such links\, short wavelengths permit massive spatial multiplexing both for network nodes and point-point links\, permitting aggregate transmission capacities approaching 1Tb/s. 100-300GHz radar imaging systems can provide thousands of image pixels and sub-degree angular resolution from small apertures\, supporting foul-weather driving and aviation. Challenges include the mm-wave IC designs\, the physical design of the front-end modules\, the complexity of the back-end digital beamformer required for spatial multiplexing\, and\, for imaging\, the development of system architectures requiring far fewer RF channels than the number of image pixels. We will describe transistor development\, IC design\, and system design\, and describe our efforts to develop 140GHz massive MIMO wireless hubs\, and 210GHz and 280GHz MIMO backhaul links.\nVirtual: https://events.vtools.ieee.org/m/419492
URL:https://ieee.org.il/event/100-300-ghz-wireless-transistors-ics-systems-prof-mark-rodwell-university-of-california-santa-barbara/
LOCATION:Virtual: https://events.vtools.ieee.org/m/419492
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20240519T161900
DTEND;TZID=Asia/Jerusalem:20240519T173000
DTSTAMP:20260404T040256
CREATED:20240426T170020Z
LAST-MODIFIED:20240518T203514Z
UID:2410-1716135540-1716139800@ieee.org.il
SUMMARY:RE: Monthly webinar – Automotive: Transitioning to Centralized Architectures
DESCRIPTION:RE: Monthly webinar – Automotive: Transitioning to Centralized Architectures\nSpeaker: Mr. Moshe Anschel\, Technical Fellow at General Motors\nDate: Sunday\, May 19th\, 2024 4:30 PM (Israel Time).\nDear IEEE Israel chapter members\, Dear guests\,\nThe IEEE Computer Society Israel conducts a series of webinars in different areas of computer systems\, Software engineering\, Computer architectures\, data center\, accelerators for machine learning\, security\, and more. The webinars offer insightful and enriching talks held by international leaders and professionals of the computer society sector.\nThe next free online webinar will include a special talk “Automotive: Transitioning to Centralized Architectures” by Mr. Moshe Anschel\, Technical Fellow at General Motors.\nA New Era for Software-Defined Vehicles: This presentation will explore the latest architectural shifts in the realm of software-defined vehicles\, particularly the transition from distributed to centralized architectures. We will provide a high-level overview of the hardware central computer and discuss the emerging silicon trends influencing these centralized computer architectures. Additionally\, we will delve into the deployment of software on these SoCs. Join us as we navigate the evolving landscape of vehicle hardware and software and envision the future of automotive technology.\nThe Webinar is free\, but pre-registration is required. So\, please sign up using this (https://technion.zoom.us/webinar/register/WN_57Ts8TMOSjKCMGemozPKyg#/registration) and the Zoom session details will be provided after registration.\nPlease contact us for any further details and updates on the series of IEEE Computer Society Webinars.We are looking forward to your participation and future collaboration.\nProf. Avi Mendelson Prof. Freddy Gabbay\nAvi.mendelson@technion.ac.il freddy.gabbay@mail.huji.ac.il\nChairman Vice-Chair\nCo-sponsored by: Freddy Gabbay\nVirtual: https://events.vtools.ieee.org/m/418799
URL:https://ieee.org.il/event/re-monthly-webinar-automotive-transitioning-to-centralized-architectures/
LOCATION:Virtual: https://events.vtools.ieee.org/m/418799
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20240603T134000
DTEND;TZID=Asia/Jerusalem:20240604T134200
DTSTAMP:20260404T040256
CREATED:20240526T221521Z
LAST-MODIFIED:20240602T230327Z
UID:2446-1717422000-1717508520@ieee.org.il
SUMMARY:הכנס הבינלאומי - INCOSE IL 2024 - הנדסת מערכות בעידן ה-AI - מגמות ויישומים
DESCRIPTION:האיגוד הישראלי להנדסת מערכות (INCOSE-IL) מזמין נציגים ועמיתים מארגוניכם להשתתף בכנס השנתי – הנדסת מערכות בעידן ה-AI שייערך ב- 3.6.2024 במלון דניאל בהרצליה. ביום שלישי ה-4.6.2024 נקיים יום של סדנאות באופן מקוון בהשתתפות מרצים מהארץ ומחו"ל.\nהכנס השנה הינו הזדמנות לשתף אוכלוסיות רחבות מהתעשייה והאקדמיה בנושאי הנדסת מערכות וליצור בעקבותיו היכרויות בין העוסקים בהנדסת מערכות\, להרחיב את השת"פ תעשייה – אקדמיה\, להתעדכן בכלים ושיטות ולהרחיב ולהעמיק את העשייה בגישה של הנדסת מערכות.\nמטרות הכנס\nהתפתחות הדיגיטציה והאוטומציה בעולם בכלל ובעולם הטכנולוגי בפרט יצרה הזדמנויות לצד אתגרים : תחלופה ותזזיתיות בשוק העבודה אל מול ההסתגלות ליכולת השפעה בו זמנית מנקודות שונות על הגלובוס. מגוון עצום של יכולות ויישומים בתחום הבינה המלאכותית והתקדמות משמעותית בפיתוח מערכות אוטונומיות.\nהכנס יעסוק בנושאים אלה לצורך מינוף והשפעה על נקודת העבודה\, על היכולת להתך ולקבל החלטה על סמך מידע שונה ומגוון. נעסוק בשאלה כיצד נדע שהמידע מהימן ואיך יכולות ויישומי ה-AI יתרמו לנו בפיתוח המערכות. בכנס יוצגו דרכים ושיטות לשימוש במידע שנאסף לאורך תהליכי הפיתוח\, הבדיקות והניסויים כדי להגיע לבשלות תכן גבוהה\, לאספקת מערכות אמינות ללקוחות וזאת בזמן קצר הרבה יותר.\nנושאים מרכזיים בהם יעסוק הכנס:\n– היכרות עם הנדסת מערכת דיגיטלית\, מערכות אוטונומיות\, כלים ושיטות לקבלת החלטות ושילובם במערכות.\n– שימוש ויישום AI באקדמיה ובתעשיות לאורך מחזור חיים שלם.\n– יישומי בינה מלאכותית במערכות אוטונומיות.\n– בינה מלאכותית ככלי תומך בקבלת החלטות.\n– איסוף מידע במהלך הפיתוח\, האימות\, התיקוף והניסויים להגדלת אמינות המערכות בשלב המסירה.\nהכנס יכלול:\n– הרצאות פתיחה שיעסקו בסקירה ויישום בולט של בינה מלאכותית בהנדסת מערכת בתעשיות "הגדולות" והקלאסיות ובתעשיות "הזריזות" (דוגמת סטארט-אפים).\n– שני מסלולים מקבילים\, בכל מסלול יהיו שלושה מושבים.\n– בסיום הכנס נקיים פנל מומחים בנושא מה נוכל ללמוד מהמערכות האוטונומיות וכיצד ניתן לשכלל את יכולות הנדסת המערכות האנושיות.\n– כחלק בלתי נפרד מהכנס נקיים תצוגת פוסטרים של פרויקטי גמר של סטודנטים לתואר שני בהנדסת מערכות מהמוסדות האקדמיים בארץ.\n– הכנס יכלול יום סדנאות בזום בהשתתפות מומחים מהארץ ומחו"ל.\nCo-sponsored by: Israeli Systems Engineering Association – INCOSE IL\nAgenda:\nתכנית הכנס:\nיום הכנס – 3 ביוני 2024 – https://www.incoseil.org/activity_page/incoseil2024/assets/INCOSEIL2024.DAY1-Program.pdf\nיום הסדנאות – 4 ביוני 2024 – https://www.incoseil.org/activity_page/incoseil2024/assets/INCOSEIL2024.DAY2-Program.pdf\nBldg: Daniel Herzliya Hotel\, 60 Ramat Yam St\, Herzliya\, Central District\, Israel\, 46851
URL:https://ieee.org.il/event/%d7%94%d7%9b%d7%a0%d7%a1-%d7%94%d7%91%d7%99%d7%a0%d7%9c%d7%90%d7%95%d7%9e%d7%99-incose-il-2024-%d7%94%d7%a0%d7%93%d7%a1%d7%aa-%d7%9e%d7%a2%d7%a8%d7%9b%d7%95%d7%aa-%d7%91%d7%a2%d7%99%d7%93%d7%9f/
LOCATION:Bldg: Daniel Herzliya Hotel\, 60 Ramat Yam St\, Herzliya\, Central District\, Israel\, 46851
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20240627T180700
DTEND;TZID=Asia/Jerusalem:20240627T180900
DTSTAMP:20260404T040256
CREATED:20240603T230049Z
LAST-MODIFIED:20240626T183141Z
UID:2456-1719511620-1719511740@ieee.org.il
SUMMARY:The 4th Annual & Students Conference of the Israeli Smart Transportation Research Center
DESCRIPTION:Resilience to Disruption and Disaster\nThe 4th Annual & Students Conference of the Israeli Smart Transportation Research Center\nCo-sponsored by: ISTRC\, BGU\nAgenda:\nProgram Overview\nThe conference will be held at Senate Hall\, Building 71\n09:15-09:45 Registration\n10:45-11:15 Greetings and Intro\n– Prof. Raz Jelinek\, VP and Dean for Research and Development\n– Tchiya Allon\, General Manager of The Israeli Smart Transportation Research Center\n– Prof. Eran Ben-Elia\, Head of BGU CITI Center for Intelligent Transportation & Innovation\n10:15-11:15 Keynote Prof. Yoram Shiftan – ISTRC head\nFrom restoration to resilience – can technology recover transportation systems?\n11:15-11:30 Coffee Break\n11:30-13:00 Session 1- Parallel Sessions\nAutonomous Vehicles\nBarkan Hall(building 70)\nChair – Prof. Igal Bilik\nPublic Transport & shared mobility\nSenate Hall(building 71)\nChair – Prof. Eran Ben-Elia\n13:00-14:00 Lunch & Formula Exposition\n13:45-14:45 Poster Session\n14:45-15:30 Session 2 – Parallel Sessions\nAlgorithms\, optimization\, and big\ndata\nBarkan Hall(building 70)\nChair – Prof. Hillel Bar-Gerahttps://lp.vp4.me/tzw8\nRoad users: safety\, health & ethics\nSenate Hall(building 71)\nChair – Prof. Tal Oron Gilad\n15:30-15:45 Coffee Break\n15:45-16:50 Panel Discussion – Resilience to Disruption Is smart transportation the solution?\nProf. David Shinar\, Department of Industrial Engineering and Management\n16:50-17:15 Prizes and Concluding Remarks\nProf. Eran Ben-Elia\, Head of BGU CITI Center for Intelligent Transportation & Innovation\nBldg: 70\, Ben gurion University\, BEER-SHEVA\, Southern District\, Israel\, 84105
URL:https://ieee.org.il/event/the-4th-annual-students-conference-of-the-israeli-smart-transportation-research-center/
LOCATION:Bldg: 70\, Ben gurion University\, BEER-SHEVA\, Southern District\, Israel\, 84105
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20240826T170000
DTEND;TZID=Asia/Jerusalem:20240826T180000
DTSTAMP:20260404T040256
CREATED:20240812T094520Z
LAST-MODIFIED:20240826T114849Z
UID:2548-1724691600-1724695200@ieee.org.il
SUMMARY:Webinar - Universal Chiplet Interconnect ExpressTM (UCIeTM): An Open Interconnect Standard for Innovations On-Package
DESCRIPTION:RE: Monthly webinar – Universal Chiplet Interconnect ExpressTM (UCIeTM): An Open Interconnect Standard for Innovations On-Package\nSpeaker: Dr. Debendra Das Sharma\, Senior Fellow\, co-GM Memory and I/O Technologies\, Intel\nDate: Monday\, August 26th\, 2024 5:00 PM (Israel Time).\nDear IEEE Israel chapter members\, Dear guests\,\nThe IEEE Computer Society Israel conducts a series of webinars in different areas of computer systems\, Software engineering\, Computer architectures\, data center\, accelerators for machine learning\, security\, and more. The webinars offer insightful and enriching talks held by international leaders and professionals of the computer society sector.\nThe next free online webinar will include a special talk “Universal Chiplet Interconnect ExpressTM (UCIeTM): An Open Interconnect Standard for Innovations On-Package” by Dr. Debendra Das Sharma\, Senior Fellow\, co-GM Memory and I/O Technologies\, Intel.\nA High-performance workloads demand on-package integration of heterogeneous processing units\, on-package memory\, and communication infrastructure such as co-packaged optics to meet the demands of the computing landscape. On-package interconnects are a critical component to deliver the power-efficient performance with the right feature set in this evolving landscape. Universal Chiplet Interconnect Express (UCIe) is an open industry standard with a fully specified stack that comprehends plug-and-play interoperability of chiplets; like the seamless interoperability on board with well-established and successful off-package interconnect standards such PCI Express® and Compute Express Link (CXL)®. In this talk\, we will discuss the usages and key metrics associated with different technology choices in UCIe and how it will evolve going forward from a planar interconnect (2D/ 2.5D) to 3D to deliver superior power-performance metrics. We will also delve into the challenges and opportunities for chiplets connected through UCIe.\nThe Webinar is free\, but pre-registration is required. So\, please sign up using this (https://technion.zoom.us/webinar/register/WN_wQ4DQaI5T8mUW_HbIcfDyA#/registration) and the Zoom session details will be provided after registration.\nPlease contact us for any further details and updates on the series of IEEE Computer Society Webinars.We are looking forward to your participation and future collaboration.\nProf. Avi Mendelson Prof. Freddy Gabbay\nAvi.mendelson@technion.ac.il freddy.gabbay@mail.huji.ac.il\nChairman Vice-Chair\nVirtual: https://events.vtools.ieee.org/m/430368
URL:https://ieee.org.il/event/webinar-universal-chiplet-interconnect-expresstm-ucietm-an-open-interconnect-standard-for-innovations-on-package/
LOCATION:Virtual: https://events.vtools.ieee.org/m/430368
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20240904T090000
DTEND;TZID=Asia/Jerusalem:20240904T174500
DTSTAMP:20260404T040256
CREATED:20240903T130020Z
LAST-MODIFIED:20240903T130301Z
UID:2575-1725440400-1725471900@ieee.org.il
SUMMARY:VCSEL Consortium Annual Meeting
DESCRIPTION:You are cordially invited to the annual meeting highlighting the VCSEL Consortium achievements by the Consortium members including two lectures by prominent guest scientists in the field.\nCo-sponsored by: Israel Innovation Authority\nAgenda:\n08:30-09:00 Get together\n09:00-09:30 Introduction:\nDr. Yehoshua Kalisky\, Technical Manager\nDr. Yoram Karny\, Chairman of the Cosortium\nGreetings:\nDr. Ilan Steiner\, Chief Finance and Operations Officer\, INSS\nMr. Moshe Avrahami\, Consortia Incentive Program\, Technological Infrastructure Division\n09:30-10:30 Professor Dr. Dieter Bimberg\, CIOMP\, Chinese Academy of Sciences and Technical University Berlin\, "Energy efficiency of optical communication in data centers"\n10:30-11:00 Professor Gadi Eisenstein\, PI\, Technion\, "On the relationship between electrical and electro-optical properties of VCSEL's"\n11:00-11:30 Professor Meir Orenstein\, Technion\, "Modes and Complexity in VCSELs"\n11:30-11:45 Coffee break\n11:45-12:15 Dr. Dan Yanson\, Senior Principal Scientist\, SCD SemiConductor Devices\, "An (in)coherent story of developing coherent VCSEL arrays at SCD"\n12:15-12:45 Professor Dan Marom\, Hebrew University\, "VCSEL source array spatial multiplexing with Photonic Lanterns"\n12:45-13:15 Dr. Yuri Berk\, Sr. Staff Engineer\, Nvidia\, "GaAs-based VCSELs for Rb-Atomic Clock and optical transceivers”\n13:15-13:45 Lunch break\n13:45-14:15 Dr. Yoel Sabag\, Head of Phys. Dept.\, AccuBeat\, "VCSEL characterization for atomic clock based on CPT (coherent population trapping) technology"\n14:15-14:45 Natan Kaplan\, CTO\, Holo/Or\, ‘’High power laser beam shaping – review of selected laser material processing applications ‘’\n14:45-15:15 Dr. Inbar Dag Hartman\, VP R&D\, Phononics\, "Integration of Diamond Heat Spreaders to VCSEL GaAs Substrates"\n15:15-15:30 Coffee break\n15:30-16:00 Eitan Neeman\, Advanced EMS Director\, INPACK-Advanced packaging\, "VECSEL assembly process & heat management solutions"\n16:00-16:30 Eng. Ariel Roizman\, Project Manager\, Civan Advanced Technologies\, "Applications of coherent VCSELs for CBC"\n16:30-17:15 Professor Kent D. Choquette\, Electrical and Computer Engineering Department\, University of Illinois Urbana\, IL 61802 (by zoom)\, "VCSEL Mode Engineering"\n17:15-17:45 Dr. Yonatan Plotnik (C/O Professor Moti Segev)\, Technion)\, "Photonics in Time-Varying Media"\nBldg: Institute for National Security Studies (INSS)\, Chaim Levanon St 40\, Tel Aviv-Yafo\, Tel Aviv\, Tel Aviv District\, Israel
URL:https://ieee.org.il/event/vcsel-consortium-annual-meeting/
LOCATION:Bldg: Institute for National Security Studies (INSS)\, Chaim Levanon St 40\, Tel Aviv-Yafo\, Tel Aviv\, Tel Aviv District\, Israel
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20240923T103000
DTEND;TZID=Asia/Jerusalem:20240923T140000
DTSTAMP:20260404T040256
CREATED:20240909T133021Z
LAST-MODIFIED:20240922T151601Z
UID:2583-1727087400-1727100000@ieee.org.il
SUMMARY:New Trends and Developments in the World of Photonics
DESCRIPTION:SOREQ/ISORAD and Photonics Israel invite engineers and scientists from the photonics industry and academia to attend the conference and participate in a tour of the Israel Center for Advanced Photonics' Lab.\nCo-sponsored by: Israel Center for Advanced Photonics (ACAP)\nSpeaker(s): Lutz Aschke\, Alon Stopel\, Ohad Zohar\nAgenda:\n[]\nBldg: Yavne Cultural Center\, Olesh 1\, Yavne\, Tel Aviv District\, Israel
URL:https://ieee.org.il/event/new-trends-and-developments-in-the-world-of-photonics/
LOCATION:Bldg: Yavne Cultural Center\, Olesh 1\, Yavne\, Tel Aviv District\, Israel
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20241112T160000
DTEND;TZID=Asia/Jerusalem:20241112T171000
DTSTAMP:20260404T040256
CREATED:20241010T183020Z
LAST-MODIFIED:20241111T224650Z
UID:2620-1731427200-1731431400@ieee.org.il
SUMMARY:הפחתת רעשים בכרטיסים אלקטרונים
DESCRIPTION:IEEE EMC & SI\, PI Israel\nואיגוד מהנדסי האלקטרוניקה בלשכת המהנדסים\nמזמינים לוובינר ללא עלות בנושא:\nהפחתת רעשים בכרטיסים אלקטרונים: כלים וגישות מתקדמות ל Board Design\nפליטה אלקטרו-מגנטית מכרטיס אלקטרוני\, נבדקת עפ”י תקנים אזרחיים /צבאיים\, ומהווה אתגר\, למתכנן המעגלים במיוחד ככל שקצבי התקשורת עולים\, היעילות האנרגטית עולה\, ואילוצי מקום ותכן קשוחים יותר.\nאתגר גדול יותר הוא תכנון מערכות המשלבות סנסורים RF’ ים\, בקרבה לרכיבים דיגיטליים. פגיעה ברגישות הקליטה של החלק ה- RF היא פועל יוצא של פליטה אלקטרו-מגנטית לא רצונית מהפעילות הדיגיטלית בקרבה.\nלפיכך\, הבנה ושליטה על מנגנוני הרעש בכרטיס\, נדרשת מכל Board Designer\nבוובינר נסקור את השיטות והכלים המתקדמים ביותר\, להתמודדות עם האתגרים הללו.\nלהרשמה ללא עלות>> https://www.aeai.org.il/activity/noise-reduction-webiner/\nעידית שפר | מנהלת איגודים\nלפעילויות הלשכה (https://www.aeai.org.il/activity/?sign)\nמשרד 03.5205818 | פקס 03.5272496\nVirtual: https://events.vtools.ieee.org/m/438854
URL:https://ieee.org.il/event/%d7%94%d7%a4%d7%97%d7%aa%d7%aa-%d7%a8%d7%a2%d7%a9%d7%99%d7%9d-%d7%91%d7%9b%d7%a8%d7%98%d7%99%d7%a1%d7%99%d7%9d-%d7%90%d7%9c%d7%a7%d7%98%d7%a8%d7%95%d7%a0%d7%99%d7%9d/
LOCATION:Virtual: https://events.vtools.ieee.org/m/438854
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20241120T173000
DTEND;TZID=Asia/Jerusalem:20241120T190000
DTSTAMP:20260404T040256
CREATED:20241119T233021Z
LAST-MODIFIED:20241119T233528Z
UID:2675-1732123800-1732129200@ieee.org.il
SUMMARY:Efficient Hardware Implementation of Deep Learning Computation and its Application - Prof. Seokbum Ko\, University of Saskatchewan\, Canada
DESCRIPTION:Abstract:\nDeep learning can provide superior performance in many fields of applications. However\, the cost of implementing deep learning models in practical applications is expensive. Deep learning models are both computation intensive and memory intensive. Computation is an important aspect for deep learning. It can determine the latency that is how fast the results can be obtained. In this seminar\, computer arithmetic for deep learning will be discussed. This lecture will start with discussing the computation requirements of deep learning models and layers. Then\, several computer arithmetic designs for deep learning in the literature will be used as examples. Finally\, future trends of computer arithmetic for deep learning computation will be discussed.\nPosit is designed as an alternative to IEEE 754 floating-point format for many applications. It has non-uniformed number distribution\, and it can provide a much larger dynamic range than IEEE floating-point format. These make posit especially suitable for deep learning applications. In recent years\, more and more posit based deep learning hardware accelerators appear in the literature. In this lecture\, the basics of posit format and the corresponding posit-based arithmetic units available in the literature\, including adder\, multiplier\, multiply-accumulate unit\, and quire operator\, will be discussed. Then\, several posit-based deep learning processors for deep learning inference and training will be discussed. Finally\, the trends and challenges of posit arithmetic units and posit based deep learning processors will be discussed to motivate more related research works.\nDeep learning applications will be shared with the audience.\nBio:\nSeokbum Ko is currently a Professor at the Department of Electrical and Computer Engineering and the Division of Biomedical Engineering\, University of Saskatchewan\, Canada. He received his PhD from the University of Rhode Island\, USA in 2002.\nHis areas of research interest include computer architecture/arithmetic\, efficient hardware implementation of compute-intensive applications\, deep learning processor architecture and biomedical engineering.\nHe is an IEEE Cicuits and Systems Society Distinguished Lecturer (2024-2025)\, a senior member of IEEE circuits and systems society and an associate editor for IEEE TVLSI\, IEEE TCAS-II\, IEEE Access and IET Computers & Digital Techniques. He is an active member of IEEE CAS Technical Committee\, IEEE P3109\, IEEE754-2029\, IEEE Domain-Specific Accelerators Standarads Committee and IEEE Emerging Processor Systems Standards Committee. He was an associate editor for IEEE TCASI (2019-2021).\nThe webinar is free but registration is required.\nZoom link will be sent after registration.\nVirtual: https://events.vtools.ieee.org/m/446950
URL:https://ieee.org.il/event/efficient-hardware-implementation-of-deep-learning-computation-and-its-application-prof-seokbum-ko-university-of-saskatchewan-canada/
LOCATION:Virtual: https://events.vtools.ieee.org/m/446950
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20241125T113000
DTEND;TZID=Asia/Jerusalem:20241125T123000
DTSTAMP:20260404T040256
CREATED:20241113T230020Z
LAST-MODIFIED:20241125T084921Z
UID:2667-1732534200-1732537800@ieee.org.il
SUMMARY:IEEE Photonics Society Distinguished Lecturer\, Daniel Renner: Monolithic\, Heterogeneous and Hybrid Photonic Integration
DESCRIPTION:Photonic integration has been at the center of photonic activity for several years. Over this period\, great strides have been made to increase the integration density and integrated chip functionality. This talk will work its way up from the drivers for photonic integration – why do we need Photonic Integrated Circuits (PICs)? What are their similarities and differences with Electronic Integrated Circuits (EICs)? This analysis of integration drivers will lead to a discussion of recent progress on the main paths: monolithic\, heterogeneous and hybrid. The talk will conclude with possible approaches to meet the additional demanding considerations for future Quantum PICs.\nSpeaker(s): \, Daniel\nRoom: 329 (third floor)\, Bldg: Engineering Building\, Bar Ilan University\, Ramat Gan\, Tel Aviv District\, Israel
URL:https://ieee.org.il/event/ieee-photonics-society-distinguished-lecturer-daniel-renner-monolithic-heterogeneous-and-hybrid-photonic-integration/
LOCATION:Room: 329 (third floor)\, Bldg: Engineering Building\, Bar Ilan University\, Ramat Gan\, Tel Aviv District\, Israel
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20241204T180000
DTEND;TZID=Asia/Jerusalem:20241204T193000
DTSTAMP:20260404T040256
CREATED:20241127T090023Z
LAST-MODIFIED:20241204T100452Z
UID:2685-1733335200-1733340600@ieee.org.il
SUMMARY:Batteries not Included: Circuits and Systems that Sense and Self-Power - Prof. Matthew Johnston\, Oregon State University
DESCRIPTION:Abstract:\nFuture wearable devices and other deployed sensor systems\, including smart agriculture or environmental monitoring\, will require new approaches for long-term powering and operation that avoid individual battery recharging. One approach is the use of thermoelectric energy harvesting\, where energy is extracted from thermal gradients using a solid-state thermoelectric generator (TEG). Even centimeter-scale TEGs can provide microwatts of power from small temperature gradients\, such as body heat\, but they present a number of challenges in terms of low-voltage\, highly-efficient energy conversion at the output.\nIn this talk\, I will present recent work in low-voltage energy harvesting applied to wearable devices\, including some of our own low-level improvements in DC-DC converters and complete thermoelectric energy harvesting solutions – including true battery-less\, wearable bioelectronic sensors powered by body heat. I will also present a number of ultra-low-power (ULP) sensor readout interface circuit approaches that enable ULP (<10µW) read-out for resistive-\, voltage-\, and current-domain sensors\, such as temperature\, pH\, and electrochemical reactions. Together\, thermoelectric energy harvesting combined with ULP sensors and read-out ICs are a promising avenue for powering wearable devices using body-heat energy harvesting.\nBio:\nMatthew Johnston received the B.S. degree in electrical engineering from the California Institute of Technology in 2005\, and the M.S. and Ph.D. degrees in electrical engineering from Columbia University in 2006 and 2012. He was a Co-Founder and Manager of Research with Helixis\, Carlsbad\, CA\, a Caltech-based spinout developing instrumentation for real-time PCR\, from 2007 to its acquisition by Illumina in 2010. From 2012 to 2013\, he was a postdoctoral scholar with the Bioelectronic Systems Lab at Columbia University. He also worked as an Associate at a life sciences venture capital firm in New York City.\nDr. Johnston joined Oregon State University in 2014\, where he is currently an Associate Professor with the School of Electrical Engineering and Computer Science. His current research interests include the integration of sensors and transducers with silicon CMOS integrated circuits\, lab-on-CMOS platforms\, ultra-low-power sensor electronics\, stretchable circuits and systems\, bio-energy harvesting\, and low-power distributed sensing.\nDr. Johnston was the recipient of the 2020 Semiconductor Research Corporation (SRC) Young Faculty Award\, the 2021 Oregon State University College of Engineering Faculty Teaching Excellence Award\, and the 2021 Oregon State University Provost Fellowship. He is currently an Associate Editor of the IEEE Transactions on Circuits and Systems II\, and he has also served as an Associate Editor for the IEEE Open Journal of Circuits and Systems and the IEEE Transactions on Biomedical Circuits and Systems.\nThe webinar is free but registration is required. Zoom link will be sent after registration.\nVirtual: https://events.vtools.ieee.org/m/448413
URL:https://ieee.org.il/event/batteries-not-included-circuits-and-systems-that-sense-and-self-power-prof-matthew-johnston-oregon-state-university/
LOCATION:Virtual: https://events.vtools.ieee.org/m/448413
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20241219T090000
DTEND;TZID=Asia/Jerusalem:20241219T172000
DTSTAMP:20260404T040256
CREATED:20241205T101521Z
LAST-MODIFIED:20241218T124902Z
UID:2696-1734598800-1734628800@ieee.org.il
SUMMARY:Antennas Symposium
DESCRIPTION:Dear Colleagues\,\nYou are cordially invited to attend The 12th Tel Aviv University Antenna Symposium on Thursday\, December 19\, 2024.\nThe conference program is attached.\nParticipation is free of charge\, but advanced registration at https://boag.sites.tau.ac.il/antenna-symposium-registration is required.\nThe same link is embedded in the program.\nPlease spread this message.\nBest regards\,\nYakir Hadad and Amir Boag\n============================================================\nProf. Amir Boag\nDepartment of Physical Electronics\, School of Electrical Engineering\nFaculty of Engineering\, Tel Aviv University\nTel Aviv 69978\, Israel\nPhone: (tel:%2B972-3-6408246) E-mail: boag@tau.ac.il\nCellular: (tel:%2B972-50-9422426)\nFax: (tel:%2B972-3-6423508) URL: https://boag.sites.tau.ac.il/\nAgenda:\n[]\nRegistration & Coffee\nWelcome\, and Opening Remarks Amir Boag\, Yakir Hadad\,\nDavide Tallini – EuroMED SIMULIA\, Non-parametric Shape Optimization of a Horn Antenna Feed Chain\,\nDr. Amir Shlivinski – BGU\, Prof. Yakir Hadad – TAU\, Universal Pulsed Radiation by Temporal Transition in Open Guiding Structures\,\nProf. Amir Boag\, Fast Time Domain Algorithms\nProf. Ehud Heyman – TAU\, Dr. Michael Katsav – Rafael\, Beam Diffraction by an Impedance Wedge: Exact and Uniform Asymptotic Solutions\, and Phenomenology\,\nProf. Reuven Shavit and Michael Elman- BGU\, Metasurface Conformal Radomes with Printed Elements\,\nProf. Eitan Bachmat – BGU\, Wave Propagation: a Multidisciplinary Approach\nLunch on site\nDr. Yarden Mazor – TAU\, Characterizing the Electric Properties of Scatterers in a Homogeneous Environment Using an Open-Ended\nCoaxial Probe\nA. Shaham\, B.-Z. Joselson\, I. Varenisov\, D. Dikarov\, and Prof. Ariel Epstein – Technion\, Temporal Wood’s Anomaly in Folded Time Gratings\nProf. Pavel Ginzburg\, et al. – TAU and Rafael\, Drone Tagging with Superscatterers\nRoee Geva\, Prof. Mário Silveirinha and Prof. Raphael Kastner – TAU and Universidade de Lisboa\, Polarization Control with PTD-Symmetric Metasurfaces\nProf. Yakir Hadad and Koffi Emanuel Sadzi – TAU\, Modeling the Particle in a Cavity Problem Using Polarizability Theory\nCoffee Break & Refreshments\nDr. Cosme Culotta-López\, et al. – Orbit/FR (MVG)\, Parallax Compensation in Offset-Mounted Spherical Near-Field Vehicular Antenna Measurements With Probe Effects for FFT-Based NFFFTs\nDr. Lea Beilkin et al. – Unidirectional Solitons in Nonlinear Electric Circuit Metamaterials\nVladimir Vulfin – EM Infinity and Prof. Reuven Shavit – BGU\, Scattering Analysis of Two Metal Beams with Rectangular Cross Section and Arbitrary Orientation\nOmry Oren\, Matar Eliaz and Prof. Eran Socher – TAU\, Controlling Beam Steering of THz CMOS DRAs Using 2D Multiport Excitation\nDr. Erez Gershnabel – IAI\, Nanophotonics and metamaterials\nProf. Timor Melamed – BGU\, Applying Beam Methods for the Design of Curved Pulsed Beams\nWine and Cheese Reception\nRoom: Auditorium 001\, Bldg: Broadcom Building\, Faculty of Engineering  Tel Aviv University\, Tel Aviv\, Tel Aviv District\, Israel
URL:https://ieee.org.il/event/antennas-symposium/
LOCATION:Room: Auditorium 001\, Bldg: Broadcom Building\, Faculty of Engineering  Tel Aviv University\, Tel Aviv\, Tel Aviv District\, Israel
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20250121T160000
DTEND;TZID=Asia/Jerusalem:20250121T183000
DTSTAMP:20260404T040256
CREATED:20250113T163023Z
LAST-MODIFIED:20250120T173307Z
UID:2742-1737475200-1737484200@ieee.org.il
SUMMARY:Oceanic Engineering Meetup
DESCRIPTION:🌊 Join Us for the first IEEE OES student event in Israel! 🌊\nThe IEEE OES Student Chapter Branch at the (https://www.linkedin.com/company/university-of-haifa/) is excited to host the Oceanic Engineering Meetup\, the first-ever OES student event in Israel.\n📅 Date: January 21st\, 2025\n⏰ Time: 16:00-18:30\n📍 Location: University of Haifa\, Multi-purpose building\, Room 223\nDiscover the latest advancements in marine and environmental technologies through talks by:\n🔹 Samuel Cohen: Autonomous surface vehicle navigation algorithm validations.\n🔹 Tom Aviksis Cohen: AI-powered oil spill detection using multisource technologies.\n🔹 Zeev Yampolsky: Data-driven frameworks for DVL calibration.\n🔹 Haitham Ezzy: Linking reef habitat features and fish diversity with 3D metrics.\n🔹 Daniel Engelsman: Learning-based gyrocompassing.\n🔹 Netta Palez & Gal Versano: Preparing ARIEL for AUV competition and research.\n✨ Don’t miss the robotic exhibition and an opportunity to network over light refreshments.\nBe part of this exciting milestone for IEEE OES in Israel—see you there!\nCo-sponsored by: Nadav Cohen\nRoom: Room 223\, Bldg: Multi-purpose building\, Abba Khoushy Ave 199\, Haifa\, Haifa District\, Israel
URL:https://ieee.org.il/event/oceanic-engineering-meetup/
LOCATION:Room: Room 223\, Bldg: Multi-purpose building\, Abba Khoushy Ave 199\, Haifa\, Haifa District\, Israel
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20250128T183000
DTEND;TZID=Asia/Jerusalem:20250128T200000
DTSTAMP:20260404T040256
CREATED:20250126T184522Z
LAST-MODIFIED:20250127T190436Z
UID:2759-1738089000-1738094400@ieee.org.il
SUMMARY:Technion CTF Team - End-of-Semester Competition
DESCRIPTION:Hello everyone!\nThe Technion's CTF group – **Technipwn** – is excited to announce the **End-of-Semester Competition**\, in collaboration with Intel\, which will take place this **Tuesday\, January 28th\, at 6:30 PM** in the **Taub Building**.\nThe competition will be held in teams of 2-3 participants\, so you can either come with a team in advance or form one during the event.\nThe challenges will cover topics learned throughout the semester\, including **web\, binary exploitation\, crypto\, and forensics** 👾\nAnd of course\, there will be **prizes for the winners** 🏅\n**Register for the competition here (limited spots):**\n(https://forms.gle/g6txmfPWuQTMCp7s8)\nSee you at the competition! 🏆\nRoom: #6 & #8\, Bldg: Taub\, Technion City\, Haifa\, Haifa District\, Israel
URL:https://ieee.org.il/event/technion-ctf-team-end-of-semester-competition/
LOCATION:Room: #6 & #8\, Bldg: Taub\, Technion City\, Haifa\, Haifa District\, Israel
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20250129T113000
DTEND;TZID=Asia/Jerusalem:20250129T123000
DTSTAMP:20260404T040256
CREATED:20250126T184522Z
LAST-MODIFIED:20250128T191857Z
UID:2761-1738150200-1738153800@ieee.org.il
SUMMARY:ceClub Seminar - Securing Modern Systems is More Challenging Than Ever (and Requires New and Dedicated Guardrails)
DESCRIPTION:Securing Modern Systems is More Challenging Than Ever (and Requires New and Dedicated Guardrails).\nAbstract. Over the past decade\, an increasing number of systems and devices have gained Internet connectivity and been enhanced with sensing capabilities and AI. While these advancements have created a world of smarter\, more automated\, and highly connected devices\, they have also introduced significant security and privacy challenges that cannot be effectively addressed with traditional countermeasures.\nIn the first part of this talk\, we will explore the security and privacy concerns of cyber-physical systems. Specifically\, we will examine new threats that have emerged with the deployment of technologies like drones and Teslas in real-world environments. Our discussion will highlight methods for detecting intrusive drone filming and securing Teslas against time-domain adversarial attacks.\nThe second part of the talk focuses on the challenges posed by the coexistence of functional devices with limited computational power (that do not adhere to Moore’s law) alongside sensors with ever-increasing sampling rates. We will explore how threats such as cryptanalysis and speech eavesdropping—previously accessible only to well-resourced adversaries—can now be executed by ordinary attackers using readily available hardware like photodiodes and video cameras. These attacks leverage optical traces or video footage from a device’s power LED to extract sensitive information.\nFinally\, in the last part of the talk\, we will address the emerging need to secure GenAI-powered applications against a new category of threats we call Promptware. This threat highlights the evolving landscape of vulnerabilities introduced by generative AI systems.\nSpeaker(s): Dr. Ben Nassi\nRoom: #506\, Bldg: Zisapel Building\, Technion City\, Haifa\, Haifa District\, Israel
URL:https://ieee.org.il/event/ceclub-seminar-securing-modern-systems-is-more-challenging-than-ever-and-requires-new-and-dedicated-guardrails/
LOCATION:Room: #506\, Bldg: Zisapel Building\, Technion City\, Haifa\, Haifa District\, Israel
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20250205T113000
DTEND;TZID=Asia/Jerusalem:20250205T123000
DTSTAMP:20260404T040256
CREATED:20250126T184523Z
LAST-MODIFIED:20250204T194853Z
UID:2763-1738755000-1738758600@ieee.org.il
SUMMARY:ceClub Seminar - Workloads\, Storage\, and Service Allocation in Edge Computing
DESCRIPTION:Workloads\, Storage\, and Service Allocation in Edge Computing\nAbstract. Edge computing extends cloud capabilities to the proximity of end-users\, offering ultra-low latency\, which is essential for real-time applications. Unlike traditional cloud systems that suffer from latency and reliability constraints due to distant datacenters\, edge computing employs a distributed model\, leveraging local edge datacenters to process and store data.\nThis talk explores key challenges in edge computing across three domains: workloads\, storage\, and service allocation.\nThe first part focuses on the absence of comprehensive edge workload datasets. Current datasets do not accurately reflect the unique attributes of edge systems. To address this\, we propose a workload composition methodology and introduce WoW-IO\, an open-source trace generator. The second part examines aspects of edge storage. Edge datacenters are significantly smaller than their cloud counterparts and require dedicated solutions. We analyze the applicability of a promising mathematical model for edge storage systems and raise inherent gaps between theory and practice. The final part addresses the virtual network embedding problem (VNEP). In VNEP\, given a set of requests for deploying virtualized applications\, the edge provider has to deploy a maximum number of them to the underlying physical network\, subject to capacity constraints. We propose novel solutions\, including a proactive service allocation strategy for mobile users\, a flexible algorithm for service allocation that is adaptable to the underlying physical topology\, and an algorithm for scalable online service allocation.\nSpeaker(s): Oleg Kolosov\nRoom: #8\, Bldg: CS Taub Building\, Technion City\, Haifa\, Haifa District\, Israel\, 3200003
URL:https://ieee.org.il/event/ceclub-seminar-workloads-storage-and-service-allocation-in-edge-computing/
LOCATION:Room: #8\, Bldg: CS Taub Building\, Technion City\, Haifa\, Haifa District\, Israel\, 3200003
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20250209T110000
DTEND;TZID=Asia/Jerusalem:20250209T123000
DTSTAMP:20260404T040256
CREATED:20250203T194522Z
LAST-MODIFIED:20250208T200122Z
UID:2776-1739098800-1739104200@ieee.org.il
SUMMARY:Special Seminar: Maximising the capacity of optical networks - how far have come and what else can we do?
DESCRIPTION:Optical fibre networks underpin the global communications infrastructure\, carrying >95% of all digital data. These optical networks operate on different time- and distance-scales – spanning long-distances (trans-oceanic\, inter-satellite) and inter-city\, as well as interconnecting servers and GPUs within data centres. The challenge for next-generation networks is in making them intelligent and adaptable to changes in demand and applications in the future.\nAdvancing AI and scientific research requires optimizing optical networks from the component through to the physical network layer. The physical topology and nonlinear properties of the optical fibre form a key bottleneck affecting achievable throughput in these networks. Optimising the throughput involves solving two NP-hard combinatorial optimisation problems: (i) the physical topology design problem and (ii) the routing and wavelength assignment problem by including the physical properties in ultrawideband optical network design – through and for artificial intelligence.\nThis talk will consider both of these challenges and their influence the maximum achievable throughput – a vital objective for the future scaling of AI algorithms.\nReferences:\n R. Matzner\, A. Ahuja\, R. Sadeghi\, M. Doherty\, S. J. Savory\, and P. Bayvel\, ‘Topology Bench: Systematic Graph Based Benchmarking for Core Optical Networks’\, arXiv preprint arXiv:submit/5982227 (2024).\n R. Matzner\, D. Semrau\, R. Luo\, G. Zervas\, and P. Bayvel\, ‘Making intelligent topology design choices: understanding structural and physical property performance implications in optical networks ’\, Journal of Optical Communications and Networking\, vol. 13\, no. 8\, p. D53\, Aug. 2021.\n R. Matzner\, R. Luo\, G. Zervas\, and P. Bayvel\, ‘Expanding Graph Neural Networks for Ultra-Fast Optical Core Network Throughput Prediction to Large Node Scales’\, in European Conference on Optical Communication (ECOC 2022)\, paper We5.61\, Optica Publishing Group\, Sep. 2022\, p. We5.61.\n R. Matzner\, R. Luo\, G. Zervas\, and P. Bayvel\, ‘Ultra-fast Optical Network Throughput Prediction using Graph Neural Networks’\, in 26th International Conference on Optical Network Design and Modelling\, May 2022\, p. 3.\n R. Matzner\, R. Luo\, G. Zervas\, and P. Bayvel\, ‘Intelligent performance inference: A graph neural network approach to modelling maximum achievable throughput in optical networks’\, APL Machine Learning\, vol. 1\, no. 2\, p. 026112\, May 2023.\nDistinguished Speaker: Prof. Polina Bayvel\n[]\nProfessor Polina Bayvel is the Head of the (https://www.ee.ucl.ac.uk/ong/) (Department of Electronic & Electrical Engineering)\, UCL\, a research group she set up in 1994. Her research interests are in the area of optical communications and networks on different time- and length scales (from trans-oceanic distances to intra- and inter-data centre communications and routing. This includes the analysis and implementation of intelligent optical networks\, wavelength routing\, high-speed optical transmission\, and the study and mitigation of optical fibre nonlinearities. Following her PhD\, she worked as a systems engineer in the STC Submarine Systems\, Greenwich (now Alcatel Submarine Networks) on the first amplified optical transmission and in Nortel (Harlow Labs) on optical network planning.\nIn 1994 she received a Royal Society University Research fellowship and moved to UCL to set up ONG\, the first academic systems engineering group in optical networks.\nShe is a Fellow of the Royal Society\, Royal Academy of Engineering\, IEEE and Optica. She is the 2021 recipient (and first woman) of the Thomas Young Medal of the UK Institute of Physics and the first woman to be awarded the 2023 Royal Society Rumford Medal since it was introduced in 1800! In 2024 she received the Humboldt Foundation Research Prize.\nAuthor/co-author of more than 500 refereed journal and conference papers\, she has led the UK EPSRC Programme Grant (https://www.unloc.net/) (2012-2018)\, focused on unlocking – and maximising – the capacity of optical fibre communications and currently leads the EPSRC Programme Grant TRANSNET (2018-2026): https://transnet.org.uk/ focused on transforming optical networks for the cloud.\nAgenda:\n11:00 – 11:30 התכנסות וכיבוד קל\n11:30 – 12:30 הרצאה של פרופ' פולינה בייבל\nRoom: Lecture Hall 001\, Bldg: Broadcom Semiconductors\, Tel Aviv University\, Dr. George Wise St. 17\, Tel Aviv\, Tel Aviv District\, Israel\, 69978
URL:https://ieee.org.il/event/special-seminar-maximising-the-capacity-of-optical-networks-how-far-have-come-and-what-else-can-we-do/
LOCATION:Room: Lecture Hall 001\, Bldg: Broadcom Semiconductors\, Tel Aviv University\, Dr. George Wise St. 17\, Tel Aviv\, Tel Aviv District\, Israel\, 69978
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20250422T123000
DTEND;TZID=Asia/Jerusalem:20250422T140000
DTSTAMP:20260404T040256
CREATED:20250329T094521Z
LAST-MODIFIED:20250421T133325Z
UID:2836-1745325000-1745330400@ieee.org.il
SUMMARY:Workshop on Renewable Energy: Importance and Future
DESCRIPTION:ستتناول هذه الورشة أهمية الطاقة المتجددة ودورها في التنمية المستدامة والتطورات المستقبلية. سيقدم الدكتور تامر الخطيب رؤىً حول حلول الطاقة المبتكرة والشبكات الذكية. ويتماشى هذا الحدث مع شعار يوم الطاقة النظيفة من خلال تعزيز الطاقة النظيفة والاستدامة.\nSpeaker(s): AL KHATEEB\,\nNABLUS \, West Bank\, Palestine
URL:https://ieee.org.il/event/workshop-on-renewable-energy-importance-and-future/
LOCATION:NABLUS \, West Bank\, Palestine
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20250423T123000
DTEND;TZID=Asia/Jerusalem:20250423T140000
DTSTAMP:20260404T040256
CREATED:20250329T094521Z
LAST-MODIFIED:20250422T134851Z
UID:2837-1745411400-1745416800@ieee.org.il
SUMMARY:Sustainability in Energy Systems
DESCRIPTION:ستستكشف هذه الورشة مبادئ الاستدامة في أنظمة الطاقة ، مع التركيز على الاستخدام الفعال للموارد، وتكامل مصادر الطاقة المتجددة، وحلول الطاقة الخضراء . سيقدم الدكتور شادي صويلحة رؤىً حول أحدث التقنيات المستدامة ودورها في تشكيل مستقبل الطاقة. تتماشى هذه الجلسة مع شعار يوم IEEE PES: "طاقة نظيفة، شبكات أذكى، وحياة أفضل".\nSpeaker(s): Swailha\,\nNABLUS \, West Bank\, Palestine
URL:https://ieee.org.il/event/sustainability-in-energy-systems/
LOCATION:NABLUS \, West Bank\, Palestine
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BEGIN:VEVENT
DTSTART;TZID=Asia/Jerusalem:20250508T170000
DTEND;TZID=Asia/Jerusalem:20250508T180000
DTSTAMP:20260404T040256
CREATED:20250412T114522Z
LAST-MODIFIED:20250507T151645Z
UID:2858-1746723600-1746727200@ieee.org.il
SUMMARY:Bendable Computing
DESCRIPTION:RE: Monthly webinar – Bendable Computing\nSpeaker: Dr. Emre Ozer\, Senior Director of Processor Development\, Pragmatic\nDate: Thursday\, May 8th\, 2025 5:00 PM (Israel Time).\nDear IEEE Israel chapter members\, Dear guests\,\nThe IEEE Computer Society Israel conducts a series of webinars in different areas of computer systems\, Software engineering\, Computer architectures\, data center\, accelerators for machine learning\, security\, and more. The webinars offer insightful and enriching talks held by international leaders and professionals of the computer society sector.\nThe next free online webinar will include a special talk “Bendable Computing” by Dr. Emre Ozer\, Senior Director of Processor Development\, Pragmatic.\nhis talk will introduce Pragmatic Semiconductor’s FlexIC technology\, and present how it allows us to develop "bendable" processors to enable emerging applications at Extreme Edge.\nThe Webinar is free\, but pre-registration is required. So\, please sign up using this (https://technion.zoom.us/meeting/register/xGDbeS8-RZaIw_OzP9ylaw) and the Zoom session details will be provided after registration.\nPlease contact us for any further details and updates on the series of IEEE Computer Society Webinars.We are looking forward to your participation and future collaboration.\nProf. Avi Mendelson  Prof. Freddy Gabbay\nAvi.mendelson@technion.ac.il    freddy.gabbay@mail.huji.ac.il\nChairman   Vice-Chair\nSpeaker(s): \, Emre\nVirtual: https://events.vtools.ieee.org/m/480935
URL:https://ieee.org.il/event/bendable-computing/
LOCATION:Virtual: https://events.vtools.ieee.org/m/480935
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